PSIS – TMM Series Laminates
TMM® laminates are thermoset, ceramic-filled polymer composites engineered for high-frequency applications in microwave, RF, and antenna systems. These laminates are designed to provide exceptional dimensional stability, consistent dielectric performance, and ease of processing.
Key Features
- Stable Dielectric Constant (Dk):
- Dielectric constant values range from 3.27 to 12.85 (frequency-dependent).
- Nearly invariant across frequency ranges, ensuring predictable performance.
- Low Dissipation Factor (Df):
- Typical values range between 0.0012 and 0.0023, suitable for high-efficiency designs.
- Excellent Thermal Management:
- High thermal conductivity reduces hotspots in power-intensive applications.
- Dimensional Stability:
- Low Z-axis expansion ensures reliable performance in multilayer configurations.
- Mechanical Robustness:
- High peel strength for copper cladding.
- Resistant to mechanical stresses during fabrication.
- Ease of Processing:
- Compatible with standard PCB fabrication techniques, including drilling, routing, and plating.
Typical Applications
- Antenna Systems
- Cellular base station antennas
- Satellite communication systems
- Power Amplifiers
- High-power RF and microwave amplifiers
- Filters and Couplers
- Bandpass and lowpass filters for high-frequency applications
- Radar Systems
- Automotive radar systems
- Airborne and ground-based radar
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Dielectric Constant (Dk) | 3.27–12.85 | IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.0012–0.0023 | IPC-TM-650 2.5.5.5 |
| Thermal Conductivity | 0.5–0.7 W/m·K | ASTM C518 |
| Coefficient of Thermal Expansion (Z-axis) | 25–60 ppm/°C | IPC-TM-650 2.4.24 |
| Peel Strength | ≥ 1.1 N/mm | IPC-TM-650 2.4.8 |
| Moisture Absorption | ≤ 0.1% | IPC-TM-650 2.6.2.1 |
Processing Guidelines
- Drilling and Routing
- Use carbide or diamond-coated tools for precision.
- Maintain clean surfaces to avoid contamination.
- Lamination
- Ensure even heat distribution during lamination.
- Use compatible prepregs or adhesive films if bonding layers.
- Plating
- TMM® laminates are compatible with standard metallization processes, including electroless copper plating.
Advantages of TMM® Laminates
- Enhanced performance in high-frequency circuits compared to traditional PTFE materials.
- Compatible with automated assembly processes for reduced fabrication costs.
- Superior mechanical and thermal properties ensure longevity in harsh environments.
Availability
TMM® laminates are available in various thicknesses and copper cladding options. Contact Rogers Corporation for custom requirements and technical support.
Compliance and Certifications
- RoHS compliant
- Halogen-free
- Meets space and aerospace application standards
