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PCB Material Specification Sheet
ROGERS

PSIS – RT-duroid 6002 Laminates

RT-duroid® 6002 laminates are PTFE-based high-frequency circuit materials reinforced with ceramic fillers. These laminates offer an exceptional combination of electrical and mechanical properties, making them ideal for microwave and RF applications. Their low dielectric constant (DkD_kDk​) and loss tangent are particularly suited for high-performance antennas, filters, and other critical RF components.

Key Features

  1. Low Dielectric Constant (DkD_kDk​):
    • Typical DkD_kDk​: 2.94 (±0.04)
    • Nearly isotropic DkD_kDk​, ensuring minimal variation across axes.
  2. Low Loss Tangent (tan⁡δ\tan\deltatanδ):
    • Typical tan⁡δ\tan\deltatanδ: 0.0012 at 10 GHz
    • Ideal for minimizing signal loss in high-frequency applications.
  3. Thermal Stability:
    • Excellent dimensional stability and low thermal expansion.
  4. Mechanical Robustness:
    • Ceramic reinforcement improves rigidity and reduces creep under mechanical stress.
  5. Easy Machinability:
    • Supports precision processing, including drilling, milling, and etching.

Applications

  • Aerospace and satellite communications
  • High-frequency antennas and radars
  • RF and microwave filters and couplers
  • High-speed digital circuits

Physical Properties

PropertyValue
Dielectric Constant (DkD_kDk​)2.94 (±0.04) at 10 GHz
Loss Tangent (tan⁡δ\tan\deltatanδ)0.0012 at 10 GHz
Thermal Conductivity0.43 W/m·K
Coefficient of Thermal Expansion (CTE)17 ppm/°C (Z-axis)
Water Absorption<0.1%
Flammability RatingUL 94 V-0

Available Thicknesses and Cladding

  1. Standard Thicknesses:
    • 0.010” (10 mils), 0.020” (20 mils), 0.030” (30 mils), 0.060” (60 mils)
  2. Copper Cladding Options:
    • Electro-deposited copper (ED)
    • Reverse-treated copper (RT)
    • Rolled annealed copper (RA)

Processing Guidelines

  1. Drilling:
    • Use carbide or diamond-coated bits for precision and durability.
    • Implement air blast cooling to avoid PTFE smearing.
  2. Etching:
    • Standard copper etchants are compatible.
  3. Lamination:
    • Pre-clean bonding surfaces to ensure adhesion.
    • Compatible with low-flow prepregs for multilayer designs.
  4. Plating:
    • Plasma treatment or sodium etching is recommended to prepare the PTFE surface.

Performance Advantages

  • Low Signal Loss:
    • Ensures excellent transmission performance in high-frequency ranges.
  • Dimensional Stability:
    • Maintains precision in high-temperature and mechanical stress conditions.
  • Environmental Resilience:
    • Resistant to moisture and chemicals, making it reliable in harsh environments.

Compliance and Certifications

  • UL 94 V-0 flammability rating
  • RoHS-compliant
  • Meets NASA outgassing requirements for aerospace applications

Author

Eleanor

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