PSIS – RO3000 Series Laminates
Rogers RO3000® series laminates are high-frequency circuit materials designed for advanced RF and microwave applications. These laminates deliver exceptional electrical performance and mechanical reliability, making them ideal for applications requiring low loss, stable dielectric properties, and ease of fabrication.
Product Overview
| Product Name | Dielectric Constant (Dk) | Dissipation Factor (Df) | Typical Applications |
|---|---|---|---|
| RO3003® | 3.00 ± 0.04 | 0.0010 | Antennas, power amplifiers |
| RO3006® | 6.15 ± 0.15 | 0.0020 | Filters, couplers |
| RO3010® | 10.2 ± 0.30 | 0.0022 | Satellite systems, high-density RF |
| RO3035® | 3.50 ± 0.05 | 0.0015 | Phased array antennas |
Key Features and Benefits
- Stable Dielectric Properties:
- Minimal variation in DkDkDk across a wide frequency range.
- Suitable for applications up to millimeter-wave frequencies.
- Low Loss Tangent (Df):
- Ensures efficient signal transmission with reduced energy loss.
- Thermal Stability:
- High TgT_gTg and low thermal expansion (CTE) provide reliability during thermal cycling.
- Compatible with a wide range of processing temperatures.
- Mechanical Robustness:
- Glass-reinforced PTFE structure offers improved dimensional stability.
- Can be processed like standard PTFE materials.
- Environmental Durability:
- Excellent resistance to moisture and chemicals ensures long-term performance.
Applications
- Microwave and RF antennas.
- Power amplifiers and low-noise amplifiers (LNAs).
- Phased-array radars.
- Satellite and aerospace systems.
- Wireless base stations.
Fabrication Guidelines
- Drilling and Routing:
- Use carbide or diamond-coated tools to maintain precision and minimize delamination.
- Employ controlled peck drilling for through-hole vias.
- Lamination:
- Compatible with RO3000 bondply for multilayer construction.
- Laminate temperature: 425∘F425^\circ \text{F}425∘F (218°C).
- Plating and Metallization:
- Plasma etching or sodium treatment improves adhesion of metal layers.
- Suitable for electroless and electrolytic copper plating.
- Etching:
- Standard copper etching techniques can be used.
- Control etch-back to preserve fine features.
Storage and Handling
- Store laminates in a clean, dry environment at 20∘C20^\circ \text{C}20∘C (68°F) and 50%50\%50% relative humidity.
- Handle with care to avoid bending or flexing, which can cause material damage.
RO3000 series laminates combine low loss, stable dielectric properties, and robust thermal and mechanical performance, making them ideal for cutting-edge RF and microwave designs. They offer compatibility with standard PTFE processes and are suitable for both single and multilayer PCB configurations.
