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PCB Material Specification Sheet
ROGERS

PSIS – RO3000 Series Laminates

1. Product Overview

The RO3000® series laminates are high-frequency circuit materials designed for RF and microwave applications. These laminates are composed of ceramic-filled PTFE composites, offering excellent dielectric properties, thermal stability, and ease of fabrication.

2. Key Features

  • Low Dielectric Loss: Ensures minimal signal attenuation for high-frequency applications.
  • Stable Dielectric Constant (Dk): Available in a range of values (3.00 to 10.2) for diverse circuit requirements.
  • Thermal Reliability: High glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) ensure stability during thermal cycling.
  • Compatibility: Suitable for hybrid designs with other materials and compatible with standard PCB fabrication processes.

3. Applications

  • RF and microwave circuits
  • Antennas
  • Power amplifiers
  • Filters and couplers
  • Satellite and aerospace systems

4. Material Properties

PropertyTypical Value
Dielectric Constant (Dk)3.00–10.2 (frequency-dependent)
Loss Tangent (Df)0.0010–0.0022 (at 10 GHz)
Thermal Conductivity0.50 W/m·K
Coefficient of Thermal Expansion (CTE): X, Y~17 ppm/°C
Copper Peel Strength≥ 8 lbs/in (1.4 N/mm)
Water Absorption< 0.1%

5. Processing Guidelines

  • Drilling: Use carbide or diamond-coated drill bits.
  • Etching: Compatible with standard PCB etching processes; maintain uniform copper thickness.
  • Plating: Suitable for electroless and electroplated copper.
  • Lamination: Follow recommended temperature and pressure profiles to prevent delamination.

6. Available Configurations

LaminatesDk RangeStandard ThicknessCopper Cladding
RO3003®3.000.010”–0.060”½ oz to 2 oz
RO3006®6.150.010”–0.060”½ oz to 2 oz
RO3010®10.20.010”–0.060”½ oz to 2 oz

7. Compliance and Certifications

  • RoHS Compliant: Yes
  • REACH Compliant: Yes
  • UL Listed: UL 94 V-0 for certain configurations
  • Aerospace Certification: Meets stringent industry requirements for aerospace and satellite systems.

8. Packaging and Storage

  • Store in a clean, dry environment with temperatures of 20–25°C (68–77°F) and relative humidity of 30–50%.
  • Keep materials flat to prevent warping.

9. Safety and Handling

  • Wear appropriate PPE during handling and machining to prevent dust inhalation or skin irritation.
  • Ensure adequate ventilation in processing areas.

Author

Eleanor

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