PSIS – RO3000 Series Laminates
1. Product Overview
The RO3000® series laminates are high-frequency circuit materials designed for RF and microwave applications. These laminates are composed of ceramic-filled PTFE composites, offering excellent dielectric properties, thermal stability, and ease of fabrication.
2. Key Features
- Low Dielectric Loss: Ensures minimal signal attenuation for high-frequency applications.
- Stable Dielectric Constant (Dk): Available in a range of values (3.00 to 10.2) for diverse circuit requirements.
- Thermal Reliability: High glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) ensure stability during thermal cycling.
- Compatibility: Suitable for hybrid designs with other materials and compatible with standard PCB fabrication processes.
3. Applications
- RF and microwave circuits
- Antennas
- Power amplifiers
- Filters and couplers
- Satellite and aerospace systems
4. Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.00–10.2 (frequency-dependent) |
| Loss Tangent (Df) | 0.0010–0.0022 (at 10 GHz) |
| Thermal Conductivity | 0.50 W/m·K |
| Coefficient of Thermal Expansion (CTE): X, Y | ~17 ppm/°C |
| Copper Peel Strength | ≥ 8 lbs/in (1.4 N/mm) |
| Water Absorption | < 0.1% |
5. Processing Guidelines
- Drilling: Use carbide or diamond-coated drill bits.
- Etching: Compatible with standard PCB etching processes; maintain uniform copper thickness.
- Plating: Suitable for electroless and electroplated copper.
- Lamination: Follow recommended temperature and pressure profiles to prevent delamination.
6. Available Configurations
| Laminates | Dk Range | Standard Thickness | Copper Cladding |
|---|---|---|---|
| RO3003® | 3.00 | 0.010”–0.060” | ½ oz to 2 oz |
| RO3006® | 6.15 | 0.010”–0.060” | ½ oz to 2 oz |
| RO3010® | 10.2 | 0.010”–0.060” | ½ oz to 2 oz |
7. Compliance and Certifications
- RoHS Compliant: Yes
- REACH Compliant: Yes
- UL Listed: UL 94 V-0 for certain configurations
- Aerospace Certification: Meets stringent industry requirements for aerospace and satellite systems.
8. Packaging and Storage
- Store in a clean, dry environment with temperatures of 20–25°C (68–77°F) and relative humidity of 30–50%.
- Keep materials flat to prevent warping.
9. Safety and Handling
- Wear appropriate PPE during handling and machining to prevent dust inhalation or skin irritation.
- Ensure adequate ventilation in processing areas.
