Over 10 years we help companies reach their financial and branding goals. Engitech is a values-driven technology agency dedicated.

Gallery

Contacts

411 University St, Seattle, USA

engitech@oceanthemes.net

+1 -800-456-478-23

PCB Material Specification Sheet
ROGERS

PSIS – CLTE Series Laminates

CLTE Series laminates are high-performance, ceramic-filled PTFE composites specifically engineered for RF, microwave, and millimeter-wave applications. These laminates exhibit excellent electrical properties, mechanical robustness, and thermal stability, making them ideal for advanced circuit designs requiring precision and reliability.

Key Features

  1. Low Loss and Consistent Dielectric Properties
    • Stable dielectric constant (Dk) across a wide frequency range.
    • Low dissipation factor (Df) for minimal signal loss.
  2. Dimensional Stability
    • Excellent thermal and mechanical stability, ensuring precision in multilayer designs.
  3. Low Coefficient of Thermal Expansion (CTE)
    • Supports high reliability and compatibility with various PCB materials.
  4. Thermal Reliability
    • High operating temperature range and low thermal conductivity.
  5. Environmental Resistance
    • Low moisture absorption and chemical resistance for robust performance in harsh environments.

Typical Applications

  • Phased array antennas
  • Power amplifiers and filters
  • Millimeter-wave communication devices
  • Automotive radar systems
  • Aerospace and defense systems

Technical Specifications

PropertyValue
Dielectric Constant (Dk)2.94 ± 0.04 (10 GHz)
Dissipation Factor (Df)≤ 0.0021 (10 GHz)
Thermal Conductivity0.5 W/m·K
Moisture Absorption< 0.05%
CTE (X-Y)~13 ppm/°C
CTE (Z)~30 ppm/°C
Flammability RatingUL 94 V-0
Operating Temperature Range-55°C to +200°C
Peel Strength (1 oz Copper)≥ 8 lbs/in

Processing Guidelines

Storage

  • Store in a clean, dry, and temperature-controlled environment.
  • Avoid exposure to direct sunlight and high humidity.

Fabrication

  • Drilling: Use carbide or diamond-coated tools with suitable entry and backer materials.
  • Etching: Compatible with industry-standard copper etching processes.
  • Lamination: Ensure proper pressure, temperature, and cooling cycles during the lamination process.

Surface Preparation

  • Clean surfaces thoroughly to ensure adhesion and plating quality.

Routing and Cutting

  • Use CNC routing or laser cutting for clean and precise edges.

Compliance and Certifications

  • RoHS and REACH compliant
  • UL 94 V-0 rated for flammability
  • Meets IPC-4103 specifications

CLTE Series laminates deliver exceptional performance for high-frequency applications, offering unmatched reliability and precision for advanced RF and microwave designs. For detailed technical assistance, please consult the manufacturer or your local distributor.

Author

Eleanor

Leave a comment

Your email address will not be published. Required fields are marked *