RT-duroid® 5880 laminates are high-performance circuit materials designed for high-frequency applications requiring low dielectric constant, low loss, and excellent stability. These laminates are widely used in aerospace, defense, and telecommunications applications.

1. Key Features

1. Low Dielectric Constant (ϵr\epsilon_rϵr​)
   • Typical value: ϵr=2.20±0.02\epsilon_r = 2.20 \pm 0.02ϵr​=2.20±0.02 (at 10 GHz).
   • Provides stable performance over a wide frequency range.
2. Low Loss Tangent (tan⁡δ\tan \deltatanδ)
   • Typical value: tan⁡δ=0.0009\tan \delta = 0.0009tanδ=0.0009 (at 10 GHz).
   • Ensures minimal signal attenuation, making it ideal for high-frequency and microwave applications.
3. Isotropic Properties
   • Nearly identical properties in all directions, ensuring uniform performance.
4. Thermal and Mechanical Stability
   • Excellent dimensional stability and low coefficient of thermal expansion (CTE).
5. High-Temperature Performance
   • Can operate in a wide temperature range without significant performance degradation.
6. Moisture Resistance
   • Very low moisture absorption, maintaining electrical performance in humid environments.

2. Material Properties

Property	Value
Dielectric Constant (ϵr\epsilon_rϵr​)	2.20 ± 0.02 (at 10 GHz)
Loss Tangent (tan⁡δ\tan \deltatanδ)	0.0009 (at 10 GHz)
Thermal Conductivity	0.2 W/m·K
Moisture Absorption	< 0.02%
CTE (X, Y Plane)	17 ppm/°C
CTE (Z Plane)	24 ppm/°C
Service Temperature Range	-250°C to +250°C
Volume Resistivity	>107 Ω⋅cm> 10^7 \, \Omega \cdot \text{cm}>107Ω⋅cm
Surface Resistivity	>106 Ω> 10^6 \, \Omega>106Ω
Peel Strength	0.7 N/mm (minimum, after thermal stress)
Flammability Rating	UL 94 V-0

3. Applications

1. Aerospace and Defense
   • Phased array antennas.
   • Radar systems.
   • Satellite communications.
2. Telecommunications
   • High-frequency transmission lines.
   • Base station antennas.
3. Automotive
   • Advanced driver-assistance systems (ADAS).
   • Vehicle-to-everything (V2X) communication.
4. Medical Devices
   • High-frequency imaging and diagnostic equipment.

4. Processing Guidelines

1. Etching
   • Standard etching processes can be used. Ensure the use of compatible etching solutions to avoid substrate degradation.
2. Drilling
   • Use carbide drills with slow spindle speeds to prevent delamination or cracking.
3. Lamination
   • Compatible with most adhesives used in multi-layer PCB constructions.
4. Soldering
   • Preheat the laminate to avoid thermal shock during soldering. Maintain soldering temperatures below 288°C.

5. Availability

Standard Thicknesses

• 0.127 mm (5 mil)
• 0.254 mm (10 mil)
• 0.508 mm (20 mil)
• 1.524 mm (60 mil)

Copper Cladding

• Available with ½ oz, 1 oz, or 2 oz rolled or electro-deposited copper.

Sheet Sizes

• Standard: 12″ x 18″, 24″ x 18″, or customized dimensions upon request.

6. Advantages of RT-Duroid® 5880

• Superior electrical performance, particularly in high-frequency applications.
• Low outgassing properties, ideal for aerospace and space applications.
• Stable mechanical and thermal behavior, even under extreme conditions.

7. Safety and Handling

• Follow standard workplace safety guidelines when machining or handling.
• Avoid inhaling dust generated during processing; use proper ventilation and PPE.
• Dispose of waste materials in compliance with local regulations.

8. Summary

RT-duroid® 5880 laminates are a premier choice for applications demanding exceptional electrical and thermal performance. Their low dielectric constant, low loss tangent, and outstanding stability make them indispensable in advanced RF and microwave designs.