The Quick Reference Processing Guidelines for RO1200 Materials provide essential recommendations to ensure optimal fabrication and performance of these advanced laminates. Key considerations include:

• Drilling:
  • Utilize rigid and supportive entry/exit materials, such as pressed phenolic.
  • Employ new drill bits to maintain hole quality.
  • Control infeed speeds and retract rates appropriately.
  • Determine hit counts with new drills as needed.
• Deburring:
  • Mechanical deburring or scrubbing is generally not recommended.
  • If deburring is necessary, apply very light pressure to avoid damaging the material.
• Hole Preparation:
  • Use pressurized water or air to purge holes effectively.
  • Perform sodium or plasma treatments prior to metal deposition to enhance adhesion.
  • Bake the material after sodium treatment to remove residual moisture.
• Metallization:
  • Opt for electroless copper processes with low or regular deposition rates, avoiding heavy deposition processes.
  • Direct deposit processes are also suitable for metallization.
• Final Surfaces:
  • Compatible with most final metal surfaces and Organic Solderability Preservatives (OSPs).
  • Preserve the post-etch surface quality and bake cores before applying Liquid Photoimageable (LPI) solder mask.
• Final Circuitization:
  • Perform routing and punching as required, ensuring material support during mechanical processes.
  • Use sharp cutting tools to maintain edge quality and prevent delamination.

Adhering to these guidelines will help achieve optimal results when working with RO1200™ materials. For a comprehensive overview, refer to the official document: Quick Reference Processing Guidelines RO1200 Materials.

By following these guidelines, manufacturers can ensure the high performance and reliability of RO1200™ laminates in their applications.