NP-175FR is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate developed by Nan Ya Plastics Corporation. It is engineered for applications requiring superior thermal stability, mechanical strength, and electrical properties, making it suitable for advanced electronic and automotive applications.

NP-175FR Key Features:

• High Tg: Approximately 175°C (DSC method), suitable for high-temperature applications.
• Lead-Free Compatibility: Designed to withstand lead-free soldering processes.
• Excellent Dimensional Stability: Ensures precision in multilayer PCB manufacturing.
• Superior Conductive Anodic Filament (CAF) Resistance: Enhances reliability by preventing electrochemical migration.
• Low Coefficient of Thermal Expansion (CTE): Reduces the risk of delamination and improves thermal reliability.
• Flammability Rating: UL 94 V-0, meeting stringent safety standards.

Typical Properties:

• Volume Resistivity: 5 × 10⁹ to 5 × 10¹⁰ MΩ-cm (C-96/35/90 condition).
• Surface Resistivity: 5 × 10⁸ to 5 × 10⁹ MΩ (C-96/35/90 condition).
• Permittivity (Dielectric Constant) at 1 MHz: 4.4 to 4.7 (C-24/23/50 condition).
• Permittivity at 1 GHz: 4.1 to 4.3 (C-24/23/50 condition).
• Loss Tangent (Dissipation Factor) at 1 MHz: 0.013 to 0.017 (C-24/23/50 condition).
• Loss Tangent at 1 GHz: 0.011 to 0.013 (C-24/23/50 condition).
• Arc Resistance: 120 seconds (D-48/50+D-0.5/23 condition).
• Dielectric Breakdown: 60 kV (D-48/50 condition).
• Moisture Absorption: 0.20% to 0.30% (D-24/23 condition).
• Peel Strength (1 oz copper): 8 to 10 lb/in after 288°C solder floating for 10 seconds.
• Thermal Stress: Withstands 288°C solder dipping for 600 seconds.
• Flexural Strength:
  • Lengthwise (LW): 480 to 550 N/mm².
  • Crosswise (CW): 415 to 480 N/mm².
• Dimensional Stability (X-Y axis): 0.005% to 0.030% (E-2/150 condition).
• Coefficient of Thermal Expansion (CTE):
  • Z-axis before Tg: 40 to 60 ppm/°C.
  • Z-axis after Tg: 250 to 270 ppm/°C.
• Thermal Decomposition Temperature (Td): 351°C (TGA, 10°C/min).

For detailed technical specifications and processing guidelines, please refer to the NP-175FR Data Sheet