NP-170R is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate produced by Nan Ya Plastics Corporation. It is designed for applications requiring excellent thermal stability, mechanical strength, and electrical properties.

NP-170R Key Features:

• High Tg: 170°C (DSC method), suitable for high-temperature applications.
• Excellent Dimensional Stability: Ensures precision in multilayer PCB manufacturing.
• Superior Through-Hole Reliability: Enhances the durability of plated through-holes during thermal cycling.
• Outstanding Heat Resistance: Suitable for lead-free soldering processes.
• Excellent Electrical and Chemical Resistance: Maintains performance in various environmental conditions.
• High Luminance Epoxy: Provides contrast with copper for Automated Optical Inspection (AOI).
• UL Designation: ANSI grade FR-4, with UL file number E98983.

Typical Properties:

• Volume Resistivity: 5 × 10⁸ to 5 × 10⁹ MΩ-cm (C-96/35/90 condition).
• Surface Resistivity: 5 × 10⁶ to 5 × 10⁷ MΩ (C-96/35/90 condition).
• Permittivity (Dielectric Constant) at 1 MHz: 4.5 to 4.7 (C-24/23/50 condition).
• Loss Tangent (Dissipation Factor) at 1 MHz: 0.015 to 0.020 (C-24/23/50 condition).
• Arc Resistance: 120 seconds (D-48/50+D-0.5/23 condition).
• Flammability: Rated UL 94V-0.
• Peel Strength (1 oz copper): 8 to 12 lb/in after 288°C solder floating for 10 seconds.
• Thermal Stress: Withstands 288°C solder dipping for 200 seconds.
• Flexural Strength:
  • Lengthwise (LW): 480 to 550 N/mm².
  • Crosswise (CW): 415 to 480 N/mm².
• Dimensional Stability (X-Y axis): 0.005% to 0.030% (E-0.5/170 condition).
• Coefficient of Thermal Expansion (CTE):
  • Z-axis before Tg: 50 to 70 ppm/°C.
  • Z-axis after Tg: 200 to 300 ppm/°C.

For detailed technical specifications and processing guidelines, please refer to the NP-170R Data Sheet