N4800-20 is a high-speed, low-loss multifunctional epoxy laminate and prepreg material developed by AGC Multi Material America, Inc. It is engineered for advanced multilayer printed circuit boards (PCBs) that require superior thermal performance and stable electrical properties.

N4800-20 Key Features:

• High Glass Transition Temperature (Tg): Approximately 210°C, suitable for high-temperature applications.
• Low Dielectric Constant (Dk): 3.6 at 2.5 GHz, ensuring signal integrity in high-frequency applications.
• Low Dissipation Factor (Df): 0.007 at 2.5 GHz, indicating minimal signal loss.
• Lead-Free Assembly Compatible: Formulated to withstand multiple 260°C lead-free soldering excursions.
• Excellent Thermal and Mechanical Properties: Very low Z-axis expansion for high reliability and excellent peel strength, making it suitable for high layer count multilayers.
• CAF Resistance: Provides excellent Conductive Anodic Filament (CAF) resistance, enhancing long-term field reliability.

Applications:

• High-speed storage networks
• Internet switches and routing systems
• Wireless communication infrastructure
• Backplanes

Technical Specifications:

• Dielectric Constant (Dk):
  • 3.6 at 2.5 GHz
  • 3.6 at 10 GHz
• Dissipation Factor (Df):
  • 0.007 at 2.5 GHz
  • 0.0075 at 10 GHz
• Coefficient of Thermal Expansion (CTE):
  • X/Y-axis: 10-14 ppm/°C (-40°C to +125°C)
  • Z-axis (Alpha 1): 27 ppm/°C (50°C to Tg)
  • Z-axis (Alpha 2): 205 ppm/°C (Tg to 260°C)
• Thermal Decomposition Temperature (Td): 360°C (5% weight loss)
• Peel Strength (1 oz Cu): 1.31 N/mm after solder float

For detailed technical specifications and processing guidelines, please refer to the N4800-20 Technical Data Sheet.