The Curamik® product suite offers best-in-class metallized ceramic substrates for higher power efficiency. Composed of pure copper bonded or brazed to a ceramic substrate, our curamik® Metallized Ceramic Substrates are designed to carry higher currents, provide higher voltage isolation, and operate over a wide temperature range.

curamik Ceramic Substrates
The high thermal conductivity, high heat capacity, and thermal diffusion of the substrate’s thick copper cladding make our substrates an integral part of power electronics. Ceramic substrates have a low coefficient of thermal expansion, which means they outperform metal or plastic based substrates.

Benefits
Good thermal conductivity and high temperature resistance
High insulation voltage
High heat dissipation
Low thermal expansion coefficient better than metal or plastic substrates
Adjustable expansion coefficient for chip-on-board
Efficient handling of master cards and individual parts
Range of formulations optimized for various power applications

Products
curamik® Endurance
Available in a wide range of ceramic types including Al 2 O 3, HPS (ZTA), AlN
Enhanced reliability performance compared to material combinations of the same size

curamik® Performance
Based on Si 3 N 4 ceramic, produced using the Active Metal Brazing (AMB) process
For applications requiring long life, high power density and robustness
Thermal conductivity of 90 W/m K @ 20°C
Available in 6 thickness combinations
CTE of 2.5 ppm/K at 20°C – 300°C

curamik® Power
Al 2 O 3 offers the best price/performance ratio
Provides adequate thermal and mechanical properties for the most common applications
Thermal conductivity of 24 W/m K @ 20°C
Available in various thickness combinations
CTE of 6.8 ppm/K at 20°C – 300°C

curamik® Power Plus
HPS substrates offer enhanced robustness through Zr-doped Al 2 O 3 ceramics
For medium power output applications
Thermal conductivity of 26 W/m K at 20°C
Available in various thickness combinations
CTE of 7.1 ppm/K at 20°C – 300°C

curamik® thermal insulation
Based on AlN ceramics, with excellent thermal conductivity and good mechanical stability
For applications with very high operating voltages and power densities
Thermal conductivity of 170 W/m K @ 20°C
Available in various thickness combinations
CTE of 4.7 ppm/K at 20°C – 300°C

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