KKPCB LTCC substrates with silver conductor material provide multilayer substrates with low dielectric loss. Coils, capacitors and resistors can be embedded in the inner layer. Ideal for high-frequency modules and silicon wafer interposer substrates.

Features
KKPCB LTCC substrates can embed coils, capacitors and resistors, thereby reducing the substrate size. Excellent dimensional tolerance of ±0.3% improves mounting accuracy. Low conductor loss is achieved by using Ag conductor material. Electroless Ni/Au or Electroless Ni/Pd/Au can be selected for surface treatment.

Material Characteristics

ITEM	UNIT	TEST CONDITIONS	NL-Ag3
COLOR	―	―	WHITE
DENSITY	g/cm3	―	2.85
BENDING STRENGTH	MPa	―	250
THERMAL EXPANSION	10-6/℃	RT～350℃	5.5
THERMAL CONDUCTIVIT	W/(m・K)	―	3.5
DIELECTRIC	―	2.3GHz	7.1
LOSS TANGENT	%	2.3GHz	0.3

Values are typical values

Design Guidelines

ITEM	UNIT	STANDARD		CUSTOM
DIMENSIONS	inch	2～4		ー
TOLERANCE	%	±0.35		ー
THICKNESS TOLERANCE	%	±10		ー
# OF LAYERS	Layer	2～		ー
VIA DIAMETER	mm	0.15, 0.2	0.1	0.085
VIA PAD DIAMETER	mm	VIA DIAMETER +0.15	VIA DIAMETER +0.1	VIA DIAMETER +0.05
VIA PICTH	mm	0.5	0.35	0.25
LINE/SPACE	mm	0.1/0.1, 0.15/0.15		0.075/0.075
LINE/VIA PAD DISTANCE	mm	0.2		0.1
VIA EDGE/SUBSTRATE EDGE DISTANCE	mm	0.5		0.25
LINE/SUBSTRATE EDGE DISTANCE	mm	0.3		0.15
CAVITY WALL WIDTH	mm	≧0.5		0.35
CAVITY DEPTH	mm	LESS THAN 2/3 OF TOTAL THICKNESS		ー
CAVITY CORNER R	mm	0.15, 0.2		0.1
CAVITY BOTTOM THICKNESS	mm	≧0.3		ー

Product application scenarios

• High-Frequency application substrates (Front-end modules, Sensor substrates)
• Substrates for small package devices
• Silicon wafer interposer substrates

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