R-1755V is a high-reliability glass epoxy multi-layer laminate developed by Panasonic, designed for applications requiring excellent thermal and mechanical performance.

R-1755V Key Features:

• High Glass Transition Temperature (Tg): Approximately 173°C, indicating superior thermal stability.
• Excellent Through-Hole Reliability: Ensures robust performance in multi-layer PCB constructions.
• Superior Conductive Anodic Filament (CAF) Resistance: Enhances long-term reliability by preventing electrical failures.
• Lead-Free Soldering Compatibility: Suitable for modern, environmentally friendly manufacturing processes.
• RoHS Compliance: Meets environmental and safety standards.

Typical Applications:

• Network Equipment: Servers, routers, and other communication devices.
• Automotive Components: Electronic control units and other in-vehicle electronics.
• Measuring Instruments: Devices requiring high precision and reliability.

Technical Specifications:

• Dielectric Constant (Dk): Approximately 4.4 at 1 GHz, supporting signal integrity in high-frequency applications.
• Dissipation Factor (Df): Approximately 0.016 at 1 GHz, indicating low signal loss.
• Coefficient of Thermal Expansion (CTE):
  • X-axis: 11-13 ppm/°C
  • Y-axis: 13-15 ppm/°C
  • Z-axis: 44 ppm/°C below Tg; 255 ppm/°C above Tg
• Thermal Decomposition Temperature (Td): Approximately 350°C, indicating high thermal stability.
• Flammability Rating: UL94 V-0, ensuring safety in various applications.

For detailed information, you can refer to the R-1755V datasheet.