IT-150DA Data Sheet
IT-150DA is a high-performance laminate material developed by ITEQ Corporation, designed for use in printed circuit boards (PCBs) that require a balance of thermal reliability, mechanical strength, and electrical performance. It is well-suited for various applications, including consumer electronics, automotive, and industrial systems.
Key Features of IT-150DA
- High Glass Transition Temperature (Tg):
- Tg: Approximately 150°C, ensuring stability in moderately high-temperature environments.
- Good Thermal Reliability:
- Suitable for lead-free soldering processes.
- Provides robust performance under thermal cycling conditions.
- Stable Electrical Properties:
- Reliable dielectric constant (Dk) and low loss tangent (Df) for consistent signal integrity.
- Mechanical Stability:
- Excellent dimensional stability and low z-axis expansion for reliable multilayer PCB performance.
- Strong peel strength ensures good copper adhesion.
- Environmentally Friendly:
- RoHS-compliant material that aligns with global green manufacturing standards.
- Process Compatibility:
- Easily processed using conventional PCB fabrication methods.
Applications of IT-150DA
- Consumer Electronics:
- Smartphones, tablets, laptops, and other gadgets requiring reliable PCB performance.
- Automotive Electronics:
- Used in control modules, infotainment systems, and other moderate-temperature automotive applications.
- Industrial Electronics:
- Ideal for power control systems, automation equipment, and industrial-grade electronic devices.
- General Purpose PCBs:
- Suitable for a wide range of applications where balanced thermal, mechanical, and electrical properties are needed.
Typical Properties
| Property | Value |
|---|---|
| Tg (Glass Transition) | ~150°C |
| Dielectric Constant (Dk) | Stable (varies with thickness) |
| Loss Tangent (Df) | Low |
| Z-Axis Expansion | Low |
| Thermal Decomposition | High (supports lead-free) |
Advantages of IT-150DA
- Provides a cost-effective solution for moderately demanding applications.
- Reliable thermal and mechanical properties suitable for multilayer PCB designs.
- Ensures signal integrity for high-speed designs while maintaining processing ease.
