IT-968 is a high-performance laminate and prepreg material developed by ITEQ Corporation, engineered for applications requiring high glass transition temperature (Tg), lead-free compatibility, and ultra-low loss characteristics. It is particularly suitable for high-speed digital and high-frequency applications, including 100G/400G switch solutions.

IT-968 Key Features:

• High Glass Transition Temperature (Tg): Approximately 185°C (by DSC), providing excellent thermal stability for high-temperature applications.
• Ultra-Low Loss Characteristics: Dielectric constant (Dk) less than 3.8 and dissipation factor (Df) less than 0.005 at 10 GHz, ensuring minimal signal loss and high signal integrity.
• Lead-Free Assembly Compatible: Designed to withstand lead-free soldering processes, making it suitable for modern electronic manufacturing standards.
• Stable Electrical Properties: Maintains consistent Dk and Df across various environmental conditions, contributing to reliable performance in high-frequency applications.

Applications:

• High-Speed Digital Circuits: Ideal for servers, storage networks, and high-speed switches requiring fast signal propagation.
• Telecommunications: Suitable for routing and switching systems, as well as other high-frequency communication devices.
• RF and Microwave Circuits: Applicable in antenna designs and wireless communication systems where low signal loss is critical.

Technical Specifications:

• Dielectric Constant (Dk) @ 10 GHz: Approximately 3.66
• Dissipation Factor (Df) @ 10 GHz: Approximately 0.0050
• Coefficient of Thermal Expansion (CTE):
  • X/Y Axis (40°C to 125°C): 12/14 ppm/°C
  • Z-Axis:
    • Alpha 1: 45 ppm/°C
    • Alpha 2: 260 ppm/°C
    • 50 to 260°C Expansion: 2.2%
• Thermal Decomposition Temperature (Td): Approximately 400°C
• Flammability Rating: UL94 V-0

For detailed information, you can refer to the IT-968 datasheet.