IT-200LK is a high-performance laminate and prepreg material developed by ITEQ Corporation, designed for applications requiring high thermal reliability, low dielectric constant (Dk), and low dissipation factor (Df). This material is particularly suitable for high-speed digital, RF, and microwave applications.

Key Features:

• High Glass Transition Temperature (Tg): Approximately 200°C, providing excellent thermal stability for high-temperature applications.
• Low Dielectric Constant and Dissipation Factor: Dk < 3.8 and Df < 0.009 at 10 GHz, ensuring minimal signal loss and high signal integrity.
• Stable Electrical Performance: Maintains consistent Dk and Df across a wide frequency range, contributing to reliable performance in high-frequency applications.
• Excellent Reliability: Demonstrates superior thermal reliability, making it suitable for lead-free soldering processes and multilayer PCB constructions.

Typical Applications:

• High-Speed Digital Circuits: Ideal for server, storage, and switch applications requiring fast signal propagation.
• RF and Microwave Circuits: Suitable for telecommunications equipment, base stations, and other high-frequency devices.
• Automotive Electronics: Applicable in advanced driver-assistance systems (ADAS) and infotainment systems where high thermal reliability is essential.

Technical Specifications:

• Glass Transition Temperature (Tg): ~200°C (DSC)
• Dielectric Constant (Dk) @ 10 GHz: 3.66
• Dissipation Factor (Df) @ 10 GHz: 0.0083
• Coefficient of Thermal Expansion (CTE):
  • α1: 40 ppm/°C
  • α2: 200 ppm/°C
• Thermal Decomposition Temperature (Td): 370°C
• Z-Axis Expansion (50-260°C): 2.5%