IT-180A Data Sheet
IT-180A is a high-performance laminate and prepreg material developed by ITEQ Corporation, known for its high thermal reliability, stable electrical properties, and compatibility with high-speed digital and RF applications. It is a versatile choice for a wide range of PCB designs, offering reliability under thermal and mechanical stresses.
Key Features of IT-180A
- High Glass Transition Temperature (Tg):
- Tg: Approximately 180°C, making it suitable for high-temperature applications and lead-free soldering processes.
- Excellent Thermal Reliability:
- Offers high thermal stability for multilayer PCBs exposed to repeated thermal cycles.
- Low z-axis expansion ensures better plated through-hole (PTH) reliability.
- Superior Electrical Performance:
- Stable dielectric constant (Dk) and low loss tangent (Df) support high-speed signal integrity.
- Mechanical Strength:
- Good peel strength for strong copper adhesion.
- Robust against mechanical stress, making it ideal for dense multilayer designs.
- Environmentally Friendly:
- RoHS-compliant and suitable for eco-friendly manufacturing processes.
- Ease of Processing:
- Compatible with standard PCB manufacturing techniques, including multilayer lamination.
Applications of IT-180A
- High-Speed Digital Electronics:
- Servers, routers, and storage systems requiring reliable signal transmission.
- Automotive Electronics:
- ADAS, engine control modules, and infotainment systems.
- Industrial Electronics:
- Robotics, automation equipment, and power systems.
- Telecommunication Systems:
- 5G infrastructure, antennas, and RF modules.
- Consumer Electronics:
- Devices with high thermal and mechanical demands.
Typical Properties
| Property | Value |
|---|---|
| Tg (Glass Transition) | ~180°C |
| Dielectric Constant (Dk) | Stable (varies by thickness) |
| Loss Tangent (Df) | Low |
| Z-Axis Expansion | Low |
| Thermal Decomposition (Td) | High (lead-free capable) |
Advantages of IT-180A
- High thermal reliability ensures long-term performance under harsh conditions.
- Excellent electrical properties provide signal integrity for high-speed and RF designs.
- Robust mechanical characteristics enhance durability in multilayer PCBs.
