IS410 is a high-performance lead-free epoxy laminate and prepreg system engineered for applications requiring enhanced thermal reliability, mechanical strength, and dimensional stability. Designed to meet the challenges of lead-free soldering processes, IS410 is ideal for high-layer-count PCBs, telecommunications, aerospace, and industrial electronics.

Key Features

1. Material Composition

• Laminate: Enhanced epoxy resin system reinforced with high-quality woven fiberglass for structural integrity.
• Prepreg: Resin-coated fiberglass for strong and reliable bonding in multilayer PCBs.

2. Thermal Properties

• Glass Transition Temperature (Tg): High Tg of 180°C, offering stability during thermal cycling and lead-free soldering.
• Decomposition Temperature (Td): Around 350°C, providing robustness under extreme thermal stress.
• Low Coefficient of Thermal Expansion (CTE): Balanced in the x/y and z axes, reducing the risk of via failure and layer separation.

3. Electrical Properties

• Dielectric Constant (Dk): Low and stable, typically 4.2 @ 1 GHz, ensuring consistent signal performance.
• Dissipation Factor (Df): Low, around 0.015 @ 1 GHz, for minimal signal loss in high-speed circuits.
• High Insulation Resistance: Maintains excellent electrical isolation in dense PCB designs.

4. Mechanical Properties

• Dimensional Stability: High resistance to warping and distortion during fabrication.
• Peel Strength: Strong adhesion between copper layers and laminate.
• Thermal Stress Resistance: Exceptional durability during multiple thermal cycles.

Applications

1. High-Speed Digital Circuits

• Ideal for networking devices, telecommunication systems, and data centers requiring stable performance under high thermal loads.

2. Multilayer PCBs

• Suitable for high-layer-count designs with complex interconnections and dense routing.

3. Aerospace and Automotive Electronics

• Withstands extreme thermal and mechanical conditions, making it suitable for mission-critical systems.

4. Industrial Electronics

• Used in control systems, power modules, and motor drivers where reliability is essential.

Technical Specifications

Property	Typical Value
Glass Transition Temperature (Tg)	180°C
Decomposition Temperature (Td)	~350°C
Dielectric Constant (Dk)	4.2 @ 1 GHz
Dissipation Factor (Df)	0.015 @ 1 GHz
Coefficient of Thermal Expansion (CTE)	X/Y: ~15 ppm/°C, Z: < 60 ppm/°C
Thermal Conductivity	~0.4 W/m·K
Peel Strength	> 8 lb/in
Flammability Rating	UL 94 V-0
Moisture Absorption	< 0.2%

Fabrication Guidelines

1. Storage and Handling

• Store prepregs in a dry environment to prevent moisture absorption.
• Handle laminates carefully to avoid contamination or mechanical damage.

2. Drilling and Hole Preparation

• Use sharp, high-quality drill bits with optimized parameters for clean hole walls.
• Apply desmear and plasma cleaning processes to ensure reliable plating adhesion.

3. Lamination Process

• Follow the recommended lamination cycle, including controlled temperature ramp-up and sufficient pressure for uniform bonding.

4. Assembly and Soldering

• Fully compatible with lead-free soldering profiles.
• Use precise reflow temperature profiles to minimize thermal stress and prevent delamination.

Advantages

• Thermal Reliability: High Tg and Td support demanding thermal environments and lead-free processes.
• Electrical Stability: Low Dk and Df maintain signal integrity in high-speed designs.
• Mechanical Durability: Excellent peel strength and dimensional stability for multilayer PCB reliability.
• Versatility: Suitable for diverse applications across industries, including telecommunications, aerospace, and industrial electronics.

The IS410 lead-free epoxy laminate and prepreg system is a robust solution for advanced PCB applications, offering a superior balance of thermal performance, electrical integrity, and mechanical strength. Its lead-free compatibility makes it an excellent choice for industries transitioning to environmentally friendly and regulatory-compliant processes.

For detailed process parameters and technical support, refer to the manufacturer’s datasheet or consult technical experts.