IC Substrate Technics Capacity

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IC Substrate Technics Capacity
Item	Description	DataSheet
Sheng Yi	Core/P.P	SI643HU, SI10U, SI09U, SI07U, SI05U
Mitsubishi Gas Chemical	Core/P.P	HL832NXA, HL832NS, HL832NSR(LC)
DooSan	Core/P.P	DS-7409HGB(S)，DS-7409HGB(LE)，DS-7409HGB(X)
Panasonic	Core/P.P	R1515E/R1515H
Other Materials	Core/P.P	E679FGB,E770G(LH)，BT-NSF(LCA)
Layer	Layer	1-16Layer
Min pattern size	um	25
Min pattern Space	um	25
Min Pad	um	80
Min BGA Center Space	um	250
2L Min Thickness	um	80
2L Min thickness/core/Pp Thickness	um	80/30
4L Min thickness/core/Pp Thickness	um	200/50/20
6L Min thickness/core/PP Thickness	um	240/50/20
8L Min thickness/core/PP Thickness	um	330/50/20
Solder mask Color		Green,Black
Solder resist		EG23A, AUS308, AUS320, AUS410
Surface treatment		Soft Gold Plating, Hard Gold Plating, ENIG, OSP
Flatness	um	5max
Min hole size	wn	100
Min Laser hole size	um	50
Min thickness tolerance	um	30
Min PP	um	25
Min Core	um	40
Minimum Finger Center Distance	um	65
Min para-position accuracy	um	15
Support Process		Subtraction process, mSAP Process
Soldermask tolerance	um	5