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IC Substrate Technics Capacity

IC Substrate Technics Capacity
Item
Description
DataSheet
Sheng Yi
Core/P.P
SI643HU, SI10U, SI09U, SI07U, SI05U
Mitsubishi Gas Chemical
Core/P.P
HL832NXA, HL832NS, HL832NSR(LC)
DooSan
Core/P.P
DS-7409HGB(S)，DS-7409HGB(LE)，DS-7409HGB(X)
Panasonic
Core/P.P
R1515E/R1515H
Other Materials
Core/P.P
E679FGB,E770G(LH)，BT-NSF(LCA)
Layer
Layer
1-16Layer
Min pattern size
um
25
Min pattern Space
um
25
Min Pad
um
80
Min BGA Center Space
um
250
2L Min Thickness
um
80
2L Min thickness/core/Pp Thickness
um
80/30
4L Min thickness/core/Pp Thickness
um
200/50/20
6L Min thickness/core/PP Thickness
um
240/50/20
8L Min thickness/core/PP Thickness
um
330/50/20
Solder mask Color
Green,Black
Solder resist
EG23A, AUS308, AUS320, AUS410
Surface treatment
Soft Gold Plating,Hard Gold Plating,ENIG,OSP
Flatness
um
5max
Min hole size
wn
100
Min Laser hole size
um
50
Min thickness tolerance
um
30
Min PP
um
25
Min Core
um
40
Minimum Finger Center Distance
um
65
Min para-position accuracy
um
15
Support Process
Subtraction process, mSAP Process
Soldermask tolerance
um
5