KKPCB HTCC substrate is a multilayer circuit substrate made of Pt conductor and alumina ceramic co-fired, and also has a cavity structure.

Features
The new KKPCB HTCC substrate uses platinum conductor, which is extremely chemically stable and not easy to oxidize, and can be used in various high-temperature environments.
Compatible with SDG, and does not require electroplating for surface treatment, which is low cost.
Bio-friendly material widely used in the medical field.
Provides the catalytic effect of Pt.
Compared with typical HTCC materials, it has higher strength due to the higher alumina content, while having the high thermal conductivity and low dielectric loss of ceramics.
High dimensional tolerance (±0.3%)

Material Characteristics

ITEM	UNIT	HTCC NHP-96
DIELECTRIC CONSTANT @1MHz/10GHZ	―	9.3/9.0
DIELECTRIC LOSS @1MHz/10GHz	×10-4	2/4
SPECIFIC GRAVITY	g/cm3	3.75
THERMIAL CONDUCTIVITY	W/(m・K)	23
THERMAL EXPANSION COEFFICIENT	ppm/℃	6.8
BENDING STRENGTH	MPa	450
MATERIAL	―	ALUMINA 96%
GREEINSHEET THICKNESS	mm	0.05～1.0
CONDUCTOR	―	Pt
SURFACE CONDUCTOR	―	Pt
DIMENSIONAL TOLERANCE	%	±0.3

Values are typical values

Design Guidelines

CATEGORY	DRAWING POSITION	ITEM	DESIGN RULES
SUBSTRATE	―	DIMENSIONS	MAX: 120x 110
	―	THICKNESS	MIN: 0.2mm
	―	CAVITY	AVAILABLE
	―	SHIPPING PACKAGE	SUBSTARTE: SEPARATE DEVICES
	―	SINGULATION	G CUT, LASER, DICING
	―	PATTERN DISTANCE TOLERANCE	MIN：±0.3%
DIELECTRIC	―	LAYER THICKNESS	0.07～1.0mm
	―	# OF LAYERS	20 LAYER CIRCUITS AVAILABLE
PATTERN (CO-FIRED)	A	VIA DIMETER	0.05～0.2mm
	Ｂ	VIA PITCH	MIN：0.25mm
	Ｃ	INTERNAL VIA PAD DIAMETER	STANDARD: VA DIAMETER + 0.05mmΦ
	Ｄ	LINE WIDTH	MIN：0.05±0.02(TARGET 0.01)mm
	E	LINE SPACE DISTANCE	MIN：0.05±0.02(TARGET 0.01)mm
	Ｆ	LINE/VIA PAD DISTANCE	MIN：0.1mm
	Ｇ	VIA EDGE/CAVITY EDGE DISTANCE	MIN：0.2mm
	Ｈ	VIA EDGE/SUBSTRATE EDGE DISTANCE	MIN：0.2mm
	J	PATTERN/SUBSTRATE EDGE DISTANCE	MIN：0.15mm
	K	VIA PAD/BULK PATTERN DISTANCE	MIN：0.2mm
	L	HOLE DIAMETER	MIN：0.55mm
	M	BULK PATTERN/SUBTRATE EDGE DISTANCEMIN:0.15mm	MIN：0.15mm
OVERCOAT (CO-FIRED)	Ｎ	OVERLAP WITH CONDUCTOR	MIN：0.075ｍｍ
	Ｐ	CLEARANCE FROM VIA	MIN：0.1mm
	Q	OVERLAP WITH CONDUCTOR	MIN：0.1mm
	R	CLEARANCE FROM CONDUCTOR	MIN：0.1mm
	S	PARTIAL OVERLAP WITH VIA	NOT AVAILABLE
	T	CLEARANCE FROM SUBSTRATE EDGE	MIN：ZERO
	U	PATTERN WIDTH	MIN：0.1mm

Product application scenarios

• Plasma (Ozone) generators
• Medical applications
• Small device packages – sensor packages

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