The HPL-03015(High Power Lighting)Laminate is specifically designed for high-power lighting applications, with a focus on providing excellent thermal management, high-frequency performance, and mechanical stability. These laminates are particularly suitable for advanced LED lighting systems, power electronics, and other applications requiring superior thermal conductivity and electrical performance.

Key Features of HPL-03015(High Power Lighting)Laminates

1. Material Composition:

• Base Material: Engineered with thermally conductive substrates, ensuring efficient heat dissipation.
• Reinforced Fiberglass: Provides mechanical strength and dimensional stability.

2. Electrical Properties:

• Dielectric Constant (Dk): Approximately 3.0 ± 0.15, making it suitable for high-frequency applications.
• Dissipation Factor (Df): Low dissipation factor (typically ≤ 0.002 at high frequencies) to minimize energy loss.

3. Thermal Properties:

• Thermal Conductivity: Designed with high thermal conductivity for efficient heat management in power-intensive applications, particularly high-power LEDs.
• High Tg (Glass Transition Temperature): Ensures performance stability under elevated temperatures.
• CTE (Coefficient of Thermal Expansion): Low CTE ensures minimal thermal expansion, reducing stress on solder joints and components.

4. Mechanical Properties:

• Dimensional Stability: Maintains structural integrity during high-temperature operations and processing.
• Durability: Resistant to thermal cycling and mechanical stress, ensuring long-term reliability.

Applications

1. High-Power LED Lighting Systems:

• Used in advanced lighting systems for architectural, industrial, and automotive applications.
• Efficient heat dissipation extends LED lifespan and maintains luminous efficiency.

2. Power Electronics:

• Ideal for power converters, amplifiers, and other power management systems requiring high thermal conductivity.

3. High-Frequency Circuits:

• Suitable for microwave and RF circuits in high-power applications.

4. Automotive and Aerospace:

• Used in lighting solutions and other electronic systems requiring robust performance in harsh environments.

Fabrication and Handling Guidelines

1. Material Preparation:

• Storage: Keep in a controlled environment to prevent moisture absorption.
• Cleaning: Ensure the laminate surface is free from contaminants for optimal performance.

2. Drilling and Etching:

• Use sharp tools and follow precise drilling and etching processes to maintain integrity and minimize stress.

3. Soldering and Assembly:

• Handle with care during soldering to avoid exceeding thermal limits and ensure proper heat dissipation.

Advantages of HPL-03015 Laminates

• Enhanced Thermal Performance: Effectively dissipates heat, reducing the risk of overheating in high-power circuits.
• High Reliability: Withstands thermal cycling and mechanical stress, ensuring long operational life.
• Low Electrical Loss: Maintains signal integrity and efficiency in high-frequency circuits.
• Versatile Applications: Suitable for a wide range of industries, including lighting, power electronics, and RF technologies.

Refer to the HPL-03015 laminate data sheet for detailed specifications and application-specific guidance.