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HDI PCB Technics Capacity

HDI PCB Technics Capacity
Item
Description
DataSheet
Material
Brand
SY、ITEQ、KB、NOUYA
HDI Construction
 
1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、Anylayer
Construction order
 
N+N、N+X+N、1+(N+X+N)+1
Layer
 
1-40Layers
Min Pattern Width/Spacing
Unit:mil
2/2
Min Mechanical Hole
Unit:mm
0.15mm
Min Thickness of Core Board
Unit:mil
2mil
Laser Hole
Unit:mm
0.075mm-0.1mm
Min thickness of PP
Unit:mm
2mil
Max diameter of resin plug hole
Unit:mm
0.4mm
Electroplating to fill holes
 
Can do it.
Electroplating to fill holes size
Unit:mil
3-5mil
hole pile pad/hole pile hole/pad hole(VOP)
mil
Can do it.
The distance from the wall of via hole to the pattern
mil
7mil
Laser drilling hole accuracy
mil
0.025mm
Min BGA pad center distance
mil
0.3mm
Min SMT
mil
0.25mm
Plating hole-filling sag
mil
≤10um
Back drilled/countersink hole tolerance
mil
±0.05mm
Through-hole plating penetration capacity
Rate
16:1
Blind hole plating penetration capacity
Rate
1.2:1
BGA min PAD
Unit:mil
0.2
Min Buried Hole(Mechanical Hole)
Unit:mil
0.2
Min Buried Hole(Laser Hole)
Unit:mil
0.1
Min Blind Hole(Laser Hole)
Unit:mil
0.1
Min Blind Hole(Mechanical Hole)
Unit:mil
0.2
Minimum spacing between laser blind hole and mechanical buried hole
Unit:mil
0.2
Min Laser Hole
Unit:mil
0.10(depth≤55um)、0.13(depth≤100um)
MinBGA pad center distance
Unit:mil
0.3
Interlaminar alignment
Unit:mil
±0.05mm(±0.002″)