HDI PCB Technics Capacity
HDI PCB Technics Capacity | ||
|---|---|---|
Item | Description | DataSheet |
Material | Brand | SY、ITEQ、KB、NOUYA |
HDI Construction | 1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、Anylayer | |
Construction order | N+N、N+X+N、1+(N+X+N)+1 | |
Layer | 1-40Layers | |
Min Pattern Width/Spacing | Unit:mil | 2/2 |
Min Mechanical Hole | Unit:mm | 0.15mm |
Min Thickness of Core Board | Unit:mil | 2mil |
Laser Hole | Unit:mm | 0.075mm-0.1mm |
Min thickness of PP | Unit:mm | 2mil |
Max diameter of resin plug hole | Unit:mm | 0.4mm |
Electroplating to fill holes | Can do it. | |
Electroplating to fill holes size | Unit:mil | 3-5mil |
hole pile pad/hole pile hole/pad hole(VOP) | mil | Can do it. |
The distance from the wall of via hole to the pattern | mil | 7mil |
Laser drilling hole accuracy | mil | 0.025mm |
Min BGA pad center distance | mil | 0.3mm |
Min SMT | mil | 0.25mm |
Plating hole-filling sag | mil | ≤10um |
Back drilled/countersink hole tolerance | mil | ±0.05mm |
Through-hole plating penetration capacity | Rate | 16:1 |
Blind hole plating penetration capacity | Rate | 1.2:1 |
BGA min PAD | Unit:mil | 0.2 |
Min Buried Hole(Mechanical Hole) | Unit:mil | 0.2 |
Min Buried Hole(Laser Hole) | Unit:mil | 0.1 |
Min Blind Hole(Laser Hole) | Unit:mil | 0.1 |
Min Blind Hole(Mechanical Hole) | Unit:mil | 0.2 |
Minimum spacing between laser blind hole and mechanical buried hole | Unit:mil | 0.2 |
Min Laser Hole | Unit:mil | 0.10(depth≤55um)、0.13(depth≤100um) |
MinBGA pad center distance | Unit:mil | 0.3 |
Interlaminar alignment | Unit:mil | ±0.05mm(±0.002″) |