KKPCB Glazed substrates have excellent surface flatness and minimal surface defects, making them ideal for thermal print heads used in fax machines, copiers and various printers.

Features
A wide range of glaze thicknesses, from 30μm to 200μm. Heat storage and heat dissipation can be controlled by adjusting the glaze thickness. Full-surface glaze or partial-surface glaze designs are available to suit application needs. Wet etching can be used to provide a variety of bump shapes and curvatures. Edge glazed substrates are also available.

Material Characteristics

ITEM	UNIT	TEST CONDITIONS	NKG-11	NKG-31	NKG-33α2	NKG-35
COLOR	ー	ー	CLEAR	CLEAR	CLEAR	CLEAR
THERMAL EXPANSION COEFFICIEN	10-6 /℃	RT～400℃	6.5	6.6	7.1	7.1
GLASS TRANSITION POINT	℃	―	673	740	685	740
SOFTENING POINT	℃	ー	850	910	850	895
DENSITY	g/cm3	ー	3.0	3.0	3.0	3.1
THERMAL CONDUCTIVITY	W/(m・K)	25℃	0.84	0.92	0.924	0.84
NOTES	ー	ー	STANDARD	HIGH THERMAL RESISTANCE	HIGH THERMAL RESISTANCE	HIGH THERMAL RESISTANCE + IMPROVED CAMBER
			THIN FILM	THIN/THICK FILM

ALL PRODUCTS – Pb FREE
Values are typical values

Design Guidelines

ITEM	UNIT	STANDARD	CUSTOM
THICKNESS	mm	0.635, 0.8, 1.0	0.5, 1.2, 1.6, 2.0
MAX DIMENSIONS	mm	325×90	720×120
GLAZE THICKNESS	μm	30～200

Product Use Cases

• Thermal printer heads for copiers, various printers
• Thermal printer heads for Point of Sale terminals

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