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PCB Manufacturing
Glazed Substrates

Glazed Substrates

KKPCB Glazed substrates have excellent surface flatness and minimal surface defects, making them ideal for thermal print heads used in fax machines, copiers and various printers.

Features
A wide range of glaze thicknesses, from 30μm to 200μm. Heat storage and heat dissipation can be controlled by adjusting the glaze thickness. Full-surface glaze or partial-surface glaze designs are available to suit application needs. Wet etching can be used to provide a variety of bump shapes and curvatures. Edge glazed substrates are also available.

Glazed Substrates

Material Characteristics

ITEMUNITTEST
CONDITIONS
NKG-11NKG-31NKG-33α2NKG-35
COLORCLEARCLEARCLEARCLEAR
THERMAL
EXPANSION
COEFFICIEN
10-6
/℃
RT~400℃6.56.67.17.1
GLASS
TRANSITION
POINT
673740685740
SOFTENING
POINT
850910850895
DENSITYg/cm33.03.03.03.1
THERMAL
CONDUCTIVITY
W/(m・K)25℃0.840.920.9240.84
NOTESSTANDARDHIGH THERMAL RESISTANCEHIGH THERMAL RESISTANCEHIGH THERMAL RESISTANCE + IMPROVED CAMBER
THIN FILMTHIN/THICK FILM

ALL PRODUCTS – Pb FREE
Values are typical values

Design Guidelines

ITEMUNITSTANDARDCUSTOM
THICKNESSmm0.635, 0.8, 1.00.5, 1.2, 1.6, 2.0
MAX DIMENSIONSmm325×90720×120
GLAZE THICKNESSμm30~200

Product Use Cases

  • Thermal printer heads for copiers, various printers
  • Thermal printer heads for Point of Sale terminals

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One-stop PCB Manufacturing and PCB Assembly solutions Manufacturer

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