The FR406BC laminate system is a high-performance epoxy-based material optimized for advanced printed circuit boards (PCBs) requiring superior thermal reliability, mechanical strength, and electrical performance. Designed with a balanced CTE and excellent through-hole reliability, it is particularly suitable for multilayer PCBs, high-speed digital designs, and RF/microwave applications.

Key Features

1. Material Composition

• Laminate: High-quality epoxy resin reinforced with woven fiberglass for structural and thermal integrity.
• Prepreg: A resin-coated fiberglass material for layer bonding in multilayer stackups.

2. Thermal Properties

• Glass Transition Temperature (Tg): 180°C, ensuring stability under elevated operating temperatures.
• Decomposition Temperature (Td): Approximately 340°C, suitable for thermal cycling and lead-free soldering.
• Low Coefficient of Thermal Expansion (CTE): Balanced CTE for improved reliability in plated through-holes (PTHs) and multilayer designs.

3. Electrical Properties

• Dielectric Constant (Dk): Stable, typically 4.4 @ 1 GHz, ensuring consistent signal performance.
• Dissipation Factor (Df): Low value, around 0.016 @ 1 GHz, for minimal signal loss.
• High Insulation Resistance: Reliable electrical isolation for multilayer designs.

4. Mechanical Properties

• Dimensional Stability: Resists warping during fabrication.
• Peel Strength: Strong adhesion between copper layers and the laminate.

Applications

1. Multilayer PCBs

• Ideal for high-layer-count designs and dense interconnect structures.

2. High-Speed Digital Circuits

• Perfect for networking devices, telecommunication systems, and data servers requiring low electrical loss.

3. RF and Microwave Circuits

• Suitable for low-frequency RF modules and antenna designs due to stable dielectric properties.

4. Aerospace and Automotive Electronics

• Performs well in harsh environments, including extreme thermal and mechanical stress.

Technical Specifications

Property	Typical Value
Glass Transition Temperature (Tg)	180°C
Decomposition Temperature (Td)	~340°C
Dielectric Constant (Dk)	4.4 @ 1 GHz
Dissipation Factor (Df)	0.016 @ 1 GHz
Coefficient of Thermal Expansion (CTE)	X/Y: ~15 ppm/°C, Z: < 60 ppm/°C
Thermal Conductivity	~0.4 W/m·K
Peel Strength	> 8 lb/in
Flammability Rating	UL 94 V-0
Moisture Absorption	< 0.2%

Fabrication Guidelines

1. Storage and Handling

• Store prepregs in a dry environment to prevent moisture absorption.
• Handle laminates with care to avoid contamination.

2. Drilling and Hole Preparation

• Use sharp drill bits with optimized feed and speed settings for clean holes.
• Employ desmear and plasma cleaning processes to ensure reliable hole-wall plating adhesion.

3. Lamination Process

• Follow the recommended press cycle, including controlled temperature ramp-up and proper pressure, to ensure uniform bonding.

4. Soldering and Assembly

• Compatible with lead-free soldering processes due to its high Tg.
• Use appropriate reflow profiles to minimize thermal stress.

Advantages

• Thermal Reliability: High Tg and Td support demanding thermal environments.
• Electrical Performance: Low Df and stable Dk make it ideal for high-frequency and high-speed designs.
• Mechanical Strength: Robust against mechanical stresses and thermal cycling.
• Versatility: Supports a wide range of applications, from telecom to aerospace.

The FR406BC laminate system provides a robust, high-reliability solution for demanding multilayer PCB designs. Its combination of thermal stability, electrical integrity, and mechanical durability makes it a preferred choice for industries such as telecommunications, aerospace, and automotive electronics.

For detailed specifications and process recommendations, consult the manufacturer’s datasheet or application notes.