RT-Duroid® 6002, 6006, and 6010 laminates are advanced materials designed for high-frequency and microwave applications, offering low dielectric constant (Dk) variability, low loss tangent (Df), and excellent thermal and mechanical stability. These guidelines provide best practices for fabricating circuits using these materials to ensure optimal performance and reliability.

1. Material Overview

• RT-Duroid 6002:
  • Dk: 2.94 ± 0.04
  • Applications: Precision RF and microwave devices, phased array antennas, and filters.
• RT-Duroid 6006:
  • Dk: 6.15 ± 0.15
  • Applications: Compact microwave circuits and antennas requiring higher dielectric constants.
• RT-Duroid 6010:
  • Dk: 10.2 ± 0.25
  • Applications: High-density and miniaturized microwave devices.

2. Machining and Handling

• Cutting and Shearing:
  • Use sharp carbide or diamond-tipped tools to minimize delamination.
  • Avoid excessive mechanical stress during cutting to prevent edge cracking.
• Drilling:
  • Tooling: Use carbide drills with optimized geometry for PTFE composites.
  • Speeds and Feeds: Use high spindle speeds (20,000–30,000 RPM) and low feed rates (0.5–3.0 inches/min).
  • Hole Quality: Perform peck drilling for deep holes and back-drill as necessary.
• Surface Preparation:
  • Clean surfaces using plasma treatment or sodium etching to ensure good adhesion.
  • Avoid mechanical abrasion, which may alter surface properties.

3. Etching and Patterning

• Copper Cladding:
  • RT-Duroid laminates are available with standard or heavy copper cladding for various RF applications.
• Etching Guidelines:
  • Use conventional PCB etching techniques, ensuring uniform removal of copper.
  • Thoroughly rinse and dry after etching to remove chemical residues.

4. Lamination and Bonding

• Multilayer Circuits:
  • Use compatible bondply materials, such as Rogers 3001 or 2929 bondply, for multilayer constructions.
  • Apply vacuum lamination to ensure even pressure distribution.
• Adhesion Promotion:
  • Perform plasma or sodium surface treatment to enhance adhesion between layers.
• Lamination Parameters:
  • Temperature: 200°C–220°C, depending on the bondply used.
  • Pressure: 200–400 psi for uniform bonding.
  • Cooling: Allow gradual cooling to room temperature to prevent stress buildup.

5. Soldering and Assembly

• Thermal Stability:
  • RT-Duroid materials have low thermal expansion, making them ideal for soldering applications.
• Soldering Temperature:
  • Use controlled soldering temperatures below 260°C to prevent damage to the material.
• Component Attachment:
  • Use low-stress attachment methods, such as conductive adhesives or low-temperature solder, for sensitive components.
• Wire Bonding:
  • Ensure surface cleanliness and use proper ultrasonic settings to prevent delamination.

6. Quality Assurance and Testing

• Dimensional Stability:
  • Verify dimensions after fabrication to ensure compliance with design tolerances.
• Electrical Testing:
  • Measure Dk, Df, and signal integrity to confirm material performance.
• Outgassing Tests (if applicable):
  • For space applications, perform vacuum outgassing tests to ensure material compatibility.

7. Storage and Handling

• Environmental Control:
  • Store laminates in a clean, dry environment to prevent contamination and moisture absorption.
• Shelf Life:
  • Use laminates within the recommended shelf life provided by the manufacturer to maintain optimal properties.

RT-Duroid 6002, 6006, and 6010 laminates are premium materials tailored for high-performance microwave and RF applications. Adherence to these fabrication guidelines ensures precise circuit construction, reliable performance, and long-term durability across a range of demanding environments.