RT-duroid® 6000 series laminates are PTFE-based composite materials designed for high-frequency applications, offering excellent electrical properties, thermal stability, and low moisture absorption. These materials are ideal for RF and microwave circuits, including antennas, filters, and power dividers. Proper fabrication techniques are essential to achieve optimal performance and reliability.

Key Material Properties

Property	RT/duroid 6002	RT/duroid 6006	RT/duroid 6010
Dielectric Constant (Dk)	2.94 ± 0.04	6.15 ± 0.15	10.2 ± 0.25
Dissipation Factor (Df)	0.0012 @ 10 GHz	0.0020 @ 10 GHz	0.0023 @ 10 GHz
Thermal Conductivity	0.50 W/m·K	0.79 W/m·K	0.86 W/m·K
Moisture Absorption	<0.1%	<0.1%	<0.1%
Glass Transition Temp (Tg)	>200°C	>200°C	>200°C

Handling and Storage

1. Material Storage:
   • Store laminates flat in a cool, dry environment (20–24°C, <50% RH).
   • Avoid prolonged exposure to UV light or direct sunlight.
2. Panel Handling:
   • Use clean gloves to prevent contamination of the surface.
   • Support panels evenly during transportation and processing.

Drilling and Hole Preparation

1. Drilling Recommendations:
   • Use carbide or diamond-coated drill bits.
   • Maintain sharp tools to prevent burring or delamination.
   • Typical drilling speeds: 50,000–80,000 RPM; feed rates: 50–100 IPM (dependent on laminate thickness).
2. Hole Cleaning:
   • Use plasma or chemical desmear processes to remove debris and ensure clean vias.

Lamination Process

1. Preparation:
   • Clean laminates and prep bonding surfaces to remove contaminants.
   • Use proper prepregs for multilayer constructions.
2. Press Cycle:
   • Temperature: 200–220°C (392–428°F).
   • Pressure: 300–400 psi.
   • Duration: 60–90 minutes, depending on stack height and prepreg used.
3. Cooling:
   • Cool under pressure to room temperature to avoid warping.

Etching and Imaging

1. Etching:
   • Use standard copper etching techniques.
   • Ensure even material removal to maintain dimensional stability.
2. Imaging:
   • Use appropriate photoresists compatible with PTFE surfaces.
   • Develop images in a controlled, clean environment.

Plating and Surface Finishing

1. Surface Preparation:
   • Perform sodium etching or plasma treatment for PTFE surface activation.
   • Ensure proper adhesion of copper and other metals.
2. Plating Options:
   • Electrolytic or electroless copper plating for reliable conductivity.
   • Surface finishes: ENIG, immersion silver, or OSP.

Stress Relief

1. Thermal Stress Relief:
   • Bake etched panels at 150–200°C (300–392°F) for 1–2 hours.
   • Use a controlled cooling process to minimize dimensional changes.

Applications

• RT-duroid 6002: Low-loss designs, phased-array antennas, and satellite communication.
• RT-duroid 6006: Power amplifiers, microwave couplers, and high-frequency filters.
• RT-duroid 6010: Compact RF designs, military radar systems, and millimeter-wave applications.

RT-duroid® 6000 series laminates provide excellent performance for high-frequency circuit applications. Adhering to proper fabrication guidelines ensures optimal electrical performance, mechanical reliability, and dimensional stability. For additional support or detailed recommendations, consult Rogers Corporation’s technical resources or contact their engineering team.