RO4360G2™ laminates from Rogers Corporation are high-frequency materials with a dielectric constant (Dk) of 6.15 ± 0.15, designed for advanced RF and microwave applications. These laminates are compatible with FR-4 processing methods, making them a cost-effective solution for high-performance circuits. The following guidelines help optimize fabrication processes to ensure reliability and performance.

Material Properties Overview

Property	Typical Value	Test Method
Dielectric Constant (Dk)	6.15 ± 0.15	IPC-TM-650 2.5.5.5 @ 10 GHz
Dissipation Factor (Df)	0.0038 @ 10 GHz	IPC-TM-650 2.5.5.5
Glass Transition Temperature (Tg)	>280°C	TMA
Thermal Conductivity	0.8 W/m·K	ASTM E1952
Peel Strength	1.0 N/mm	IPC-TM-650 2.4.8
Moisture Absorption	<0.1%	IPC-TM-650 2.6.2.1

Fabrication Guidelines

1. Drilling

• Drill Bits: Use high-speed carbide drill bits designed for PTFE and ceramic-filled laminates.
• Parameters:
  • Speed: 150,000–200,000 RPM
  • Feed Rate: 2–3 mil/rev
  • Retract Rate: 500–600 IPM
• Hole Preparation:
  • After drilling, perform plasma desmear or chemical cleaning to ensure good copper adhesion for plated through holes (PTHs).
  • Back-up and entry materials are recommended to minimize burrs and maintain clean hole walls.

2. Lamination

• Prepreg Compatibility: Use RO4450F™ prepregs for multilayer board constructions to ensure material compatibility.
• Pressure and Heat:
  • Pressure: 200–400 psi
  • Temperature: 425–450°F (220–230°C)
  • Time: Maintain peak temperature for at least 60 minutes.
• Ensure uniform pressure distribution to avoid warping or uneven bonding.

3. Etching

• Standard copper etching processes are suitable.
• Tight process controls are necessary to achieve consistent line widths, especially for RF/microwave circuits with fine geometries.

4. Solder Mask Application

• Use solder masks compatible with high-frequency laminates.
• Ensure thorough surface cleaning before application to promote adhesion.

5. Soldering

• RO4360G2 laminates are compatible with lead-free soldering processes.
• Controlled reflow profiles are necessary to avoid exceeding the material’s glass transition temperature (Tg).

6. Surface Finishing

• Compatible with a variety of surface finishes, including:
  • Electroless Nickel Immersion Gold (ENIG)
  • Immersion Tin or Silver
  • Organic Solderability Preservative (OSP)

Thermal Management Considerations

• RO4360G2 laminates offer good thermal conductivity (0.8 W/m·K), but high-power designs may require additional heat sinks or thermal vias for enhanced heat dissipation.

Best Practices

1. Material Storage:
   • Store laminates in a cool, dry environment to prevent moisture absorption.
2. Process Validation:
   • Test fabrication parameters on sample boards to ensure process compatibility and minimize errors.
3. Dimensional Stability:
   • Use compensation factors for dimensional changes during processing, especially for high-density circuits.
4. Handling Precautions:
   • Avoid bending or flexing the laminates to prevent cracking or delamination.

Applications

• High-density RF circuits.
• Power amplifiers in telecommunications.
• Aerospace and automotive radar systems.
• High-frequency filters and couplers.

RO4360G2™ laminates deliver exceptional performance for RF and microwave applications. By adhering to these fabrication guidelines, manufacturers can achieve reliable results, optimized circuit performance, and efficient production processes.