1. Overview

The RO3000® and RO3200® series materials are high-frequency laminates designed for RF and microwave applications. They are engineered to provide excellent dielectric stability, low loss, and ease of fabrication, suitable for both prototype and production runs.

2. Material Properties

• Dielectric Constant (Dk): 3.00 – 10.2 (material-specific)
• Loss Tangent (Df): Low, ensuring minimal signal loss.
• Thermal Stability: High glass transition temperature (Tg) for reliable performance under thermal cycling.
• Mechanical Stability: Low coefficient of thermal expansion (CTE), ensuring excellent dimensional stability and copper adhesion.

3. Handling and Storage

• Store materials in a controlled environment with temperatures between 20–25°C (68–77°F) and relative humidity of 30–50%.
• Avoid prolonged exposure to UV light or direct sunlight.
• Always handle using gloves to prevent contamination from oils or dirt.

4. Drilling Recommendations

• Drill Bit Type: Use carbide or diamond-coated drill bits.
• Drill Parameters:
  • Spindle speed: 30,000–100,000 RPM.
  • Feed rate: 1.5–3 mils/rev depending on laminate thickness.
• Stack Height: Optimize to minimize resin smearing; single or small stacks are recommended.
• Deburring: Use light mechanical methods to avoid delamination.

5. Etching and Patterning

• Ensure uniform copper thickness to maintain consistent signal integrity.
• Use standard alkaline or acid etching solutions suitable for PTFE or ceramic-filled materials.
• For fine-line features, apply automated inspection processes to confirm uniformity.

6. Plating and Metallization

• Surface Preparation: Perform a mechanical or plasma-based cleaning process to enhance adhesion.
• Electroless Copper Plating: Compatible with RO3000/RO3200 surfaces; follow standard copper thickness specifications.
• Avoid high-temperature plating processes to prevent substrate deformation.

7. Lamination Guidelines

• Use a bonding film or prepreg material that matches the thermal expansion characteristics of the RO3000/RO3200 series.
• Press Parameters:
  • Temperature: 200–230°C (392–446°F).
  • Pressure: 200–300 psi.
  • Time: Minimum 45 minutes.
• Cool under pressure to avoid warping.

8. Solder Mask and Legend Printing

• Use solder masks compatible with high-frequency laminates.
• Ensure the mask’s dielectric properties align with the intended application.
• Apply UV-curable or thermally stable inks for legend printing.

9. Assembly Considerations

• Thermal Management: Use controlled soldering processes, such as vapor phase or reflow, to prevent overheating.
• Component Placement: Automated placement is recommended; ensure alignment to minimize mechanical stress.
• Cleaning: Use non-abrasive and non-ionic cleaning agents to remove flux residues.

10. Testing and Quality Assurance

• Perform dielectric constant (Dk) and loss tangent (Df) verification for critical designs.
• Test for adhesion strength, peel strength, and via integrity.
• Conduct RF testing to validate signal integrity and performance.

11. Safety Precautions

• Wear appropriate personal protective equipment (PPE) when handling, drilling, or processing the material.
• Use proper ventilation during machining or soldering to avoid inhaling fine particles or fumes.

12. Recycling and Disposal

• Dispose of scrap material in accordance with local environmental regulations.
• Recycling options may be available for copper layers and laminate material.