The CS-AL-88-AD2 is a high-performance metal-based laminate engineered for high-power electronics and thermal management applications. It is specifically designed to provide superior heat dissipation, electrical insulation, and mechanical durability for demanding environments. This laminate is ideal for power modules, LED lighting systems, automotive electronics, and industrial electronics.

Key Features

1. Material Structure

• Circuit Layer: Copper foil for circuit formation, with a typical thickness range of 35 μm to 140 μm for high current-carrying capacity.
• Dielectric Layer: A thermally conductive, electrically insulating layer with excellent thermal and electrical properties.
• Base Layer: Aluminum (AL), providing mechanical support and efficient thermal dissipation.

2. Thermal Properties

• Thermal Conductivity: High thermal conductivity for efficient heat transfer, typically around 2.2–3.0 W/m·K.
• Thermal Resistance: Low thermal resistance for optimal heat dissipation.
• High Temperature Tolerance: Reliable performance at elevated operating temperatures (up to 150°C–200°C).

3. Electrical Properties

• Dielectric Strength: High breakdown voltage for safe and reliable electrical insulation.
• Low Dielectric Loss: Ensures minimal signal degradation for high-frequency circuits.

4. Mechanical Properties

• Dimensional Stability: Maintains structural integrity during thermal cycling.
• Moisture Resistance: Low moisture absorption ensures consistent performance in humid environments.
• Durability: Resistant to mechanical stress, vibrations, and thermal expansion mismatches.

Applications

1. High-Power LED Lighting

• Efficient thermal dissipation ensures prolonged LED lifespan and stable performance.
• Commonly used in industrial and automotive lighting systems.

2. Power Electronics

• Suitable for power amplifiers, converters, and inverters where heat management is critical.

3. Automotive Electronics

• Designed for engine control units (ECUs), power modules, and high-intensity headlights that operate under harsh conditions.

4. Industrial Electronics

• Ideal for motor drivers, industrial controls, and other systems requiring robust performance under high power loads.

Technical Specifications

Property	Value
Thermal Conductivity	2.2–3.0 W/m·K
Dielectric Strength	> 3.0 kV
Operating Temperature Range	-40°C to 200°C
Copper Foil Thickness	35–140 μm
Base Material	Aluminum
Dielectric Thickness	Typically 75–150 μm
Moisture Absorption	< 0.1%

Fabrication Guidelines

1. Cutting and Machining

• Use appropriate cutting tools to avoid damaging the dielectric layer.
• Ensure smooth edges for reliable assembly.

2. Drilling and Hole Preparation

• Employ sharp tools and precise drilling techniques to avoid micro-cracking.
• Use controlled speeds and cooling techniques to minimize localized heating.

3. Circuit Etching

• Standard PCB etching processes are compatible with the copper layer.
• Ensure accurate pattern formation for high-power circuits.

4. Soldering and Assembly

• Designed to withstand lead-free soldering temperatures.
• Ensure proper heat sinking during assembly to enhance thermal performance.

Advantages

• High Thermal Management: Reduces operating temperatures, improving efficiency and reliability.
• Compact Design: Supports high power densities in a small footprint.
• Cost-Effective: Combines multiple functions (thermal management, electrical insulation, and structural support) in a single laminate.
• Environmentally Robust: Resistant to moisture, mechanical stress, and thermal cycling.

The CS-AL-88-AD2 laminate is a versatile and high-performance solution for thermal and electrical management in power-intensive electronic systems. Its robust thermal properties, coupled with excellent electrical insulation and mechanical stability, make it a go-to choice for power electronics, LED systems, and automotive applications. For detailed specifications and application-specific guidance, refer to the manufacturer’s datasheet.