Thermal Clad® Laminates are engineered solutions for high-performance thermal management in power electronics. They combine excellent heat dissipation with reliable electrical insulation, making them ideal for LED lighting, automotive electronics, power supplies, and industrial applications.

This guide provides an overview of Thermal Clad® materials, their properties, and how to select the most suitable material for your application.

Key Components of Thermal Clad® Laminates

1. Dielectric Layer:
   • Provides electrical insulation between the conductive layer (copper) and the base metal.
   • Contributes to thermal conductivity and breakdown voltage.
2. Base Metal:
   • Aluminum or copper is commonly used, offering structural support and heat dissipation.
   • Aluminum provides a balance between thermal performance and cost, while copper offers superior thermal performance.
3. Circuit Layer:
   • Typically a copper foil layer where the circuit is etched.
   • Thickness ranges from 35 μm to 140 μm, depending on current-carrying requirements.

Thermal Clad® Material Categories

1. High Thermal Conductivity (HTC) Materials

• Designed for maximum heat dissipation.
• Applications: High-power LED lighting, power modules, and motor drives.
• Thermal Conductivity: Up to 3.0 W/m·K or higher.
• Examples: HT-04503, HTC Series.

2. Standard Thermal Conductivity Materials

• Balanced performance and cost.
• Applications: Consumer electronics, automotive lighting, and industrial controls.
• Thermal Conductivity: 1.0 to 2.2 W/m·K.

3. High-Temperature Materials

• Suitable for applications with elevated operating temperatures.
• Applications: Automotive engine controls, high-temperature power modules.
• Examples: HT-04503.

4. Flexible Thermal Clad®

• Incorporates flexible base materials for bending or shaping.
• Applications: Wearable electronics, flexible LED strips.

5. Thin Dielectric Materials

• For compact designs requiring reduced thermal resistance.
• Applications: Miniaturized electronics, mobile device components.

Selection Criteria for Thermal Clad® Laminates

1. Thermal Conductivity

• Choose based on the application’s heat dissipation needs.
• Higher wattage devices (e.g., power LEDs) require laminates with higher thermal conductivity.

2. Breakdown Voltage

• Ensure the dielectric layer provides sufficient isolation voltage for your application.
• Typical values range from 1 kV to 5 kV depending on the dielectric thickness.

3. Operating Temperature

• Consider materials like high-temperature laminates for environments exceeding 150°C.

4. Current-Carrying Capability

• Match the circuit layer thickness to the current requirements.
• Thicker copper (e.g., 70 μm or more) is necessary for high-current applications.

5. Mechanical Requirements

• Choose a base metal thickness to ensure mechanical integrity, especially for large-area or vibration-prone applications.
• Common thicknesses: 1.0 mm, 1.5 mm, 2.0 mm.

6. Cost-Performance Balance

• Optimize for cost when designing consumer or low-power industrial electronics.
• Use high-performance laminates for critical applications like automotive or aerospace.

Common Applications and Material Recommendations

Application	Recommended Material	Key Requirements
High-Power LED Lighting	HTC Series, HT-04503	High thermal conductivity, good mechanical support
Automotive Electronics	HT-04503, High-Temperature	High operating temperature, low thermal resistance
Power Modules	HTC Series	Excellent heat dissipation, low dielectric loss
Consumer Electronics	Standard Thermal Conductivity	Cost-effective, reliable insulation
Industrial Controls	High Thermal Conductivity	Durable, efficient heat dissipation
Flexible Circuits	Flexible Thermal Clad®	Flexibility, low profile

Fabrication Guidelines

1. Cutting:
   • Use precise cutting tools to avoid delamination or damage to the dielectric layer.
2. Drilling:
   • Sharp drill bits are necessary to prevent cracking, especially for thick dielectric layers.
3. Soldering:
   • Ensure soldering temperatures do not exceed the material’s thermal limits.
4. Assembly:
   • Employ proper heat sinking techniques to enhance heat dissipation.

Benefits of Thermal Clad® Laminates

• Enhanced Thermal Performance: Efficiently transfers heat from components to the heat sink.
• Reliable Electrical Insulation: High breakdown voltage for safe operation.
• Cost Efficiency: Combines multiple functions into a single material layer.
• Compact Design: Thin dielectric layers allow for reduced device size.

For detailed datasheets, application notes, and material specifications, consult the Thermal Clad® manufacturer’s resources.