CLTE-AT Laminates Data Sheet
CLTE-AT laminates are advanced, low-loss, ceramic-filled PTFE composite materials designed for high-performance applications. These laminates are engineered for demanding RF, microwave, and millimeter-wave circuits, offering exceptional thermal, mechanical, and electrical stability. With a low coefficient of thermal expansion (CTE) and high reliability, they are particularly suited for multilayer applications requiring tight tolerance and excellent signal integrity.
Key Features
- Low Loss and Stable Dielectric Properties
- Low dissipation factor (Df) ensures minimal signal loss.
- Consistent dielectric constant (Dk) across a wide frequency range.
- Excellent Thermal Stability
- Low CTE in all axes enhances reliability during thermal cycling.
- High glass transition temperature (Tg) ensures stability at elevated temperatures.
- Enhanced Mechanical Properties
- Outstanding dimensional stability supports fine-pitch circuit designs.
- High peel strength ensures durable copper adhesion.
- Ideal for Multilayer Applications
- Optimized for use with bonding layers in multilayer designs.
- Low Moisture Absorption
- Performs well in humid or high-moisture environments.
Applications
- Aerospace and Defense
- Phased array antennas, radar systems, and avionics.
- Automotive Electronics
- Advanced Driver-Assistance Systems (ADAS) and vehicle-to-everything (V2X) communication.
- Telecommunications
- 5G base stations, antennas, and high-speed digital circuits.
- Medical Devices
- Imaging systems and diagnostic equipment.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.00 ± 0.04 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.0017 (10 GHz) |
| Thermal Conductivity | 0.5 W/m·K |
| Coefficient of Thermal Expansion (CTE), X-Y | ~12 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Z | ~30 ppm/°C |
| Moisture Absorption | < 0.1% |
| Peel Strength (1 oz Copper) | ≥ 8 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Operating Temperature Range | -55°C to +200°C |
| Dimensional Stability | < 0.05% |
Fabrication Guidelines
- Drilling
- Use carbide or diamond-coated drill bits for clean hole formation. Deburring is recommended for precise hole quality.
- Lamination
- Follow recommended lamination cycles for optimal bonding between layers. Monitor pressure and temperature closely during the process.
- Etching
- Compatible with industry-standard chemical etchants. Properly adjust etching parameters to maintain fine trace accuracy.
- Plating
- Ensure compatibility with standard plating processes for consistent surface finishes.
- Routing and Cutting
- Utilize CNC routers or laser cutting tools for clean and precise edges.
Compliance and Certifications
- RoHS Compliant
- REACH Compliant
- UL 94 V-0 Flammability Rating
CLTE-AT laminates deliver unparalleled performance for high-frequency, high-reliability applications. Their superior thermal stability, low loss characteristics, and mechanical robustness make them an ideal choice for critical industries like aerospace, automotive, and telecommunications. For more detailed technical guidance or assistance with your application, contact the manufacturer or an authorized distributor.
