RT-duroid microwave laminates are widely used in high-frequency circuits, where precision and reliability are paramount. During the PCB manufacturing process, stress can develop in the copper and substrate due to chemical etching and thermal cycling.
The reliability of printed circuit boards (PCBs) using RT-duroid 5870 material is influenced by the adhesion of copper foil to the substrate. This study examines the impact of soldering temperatures on copper foil adhesion.
2ML™ is a thermally conductive, halogen-free epoxy laminate and prepreg material developed by Rogers Corporation. It is engineered to meet the thermal management demands of high-power electronic applications, offering enhanced heat transfer characteristics while maintaining compatibility with standard PCB fabrication processes.
N4800-20 is a high-speed, low-loss multifunctional epoxy laminate and prepreg material developed by AGC Multi Material America, Inc. It is engineered for advanced multilayer printed circuit boards (PCBs) that require superior thermal performance and stable electrical properties.
Nelco® N4000-13 is a high-speed multifunctional epoxy laminate and prepreg material engineered for advanced printed circuit board (PCB) applications requiring superior thermal performance and electrical properties.
NPGN-150PYTL, NPGN-150PYR, and NPGN-150PYB are halogen-free, flame-retardant copper-clad laminates produced by Nan Ya Plastics Corporation. These materials are designed for applications requiring high thermal stability, mechanical strength, and excellent electrical properties, making them suitable for advanced electronic applications.
NP-175FR is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate developed by Nan Ya Plastics Corporation. It is engineered for applications requiring superior thermal stability, mechanical strength, and electrical properties, making it suitable for advanced electronic and automotive applications.
NP-170R is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate produced by Nan Ya Plastics Corporation. It is designed for applications requiring excellent thermal stability, mechanical strength, and electrical properties
The XtremeSpeed™ RO1200™ Series from Rogers Corporation comprises extremely low-loss digital circuit laminates engineered for high-speed applications requiring exceptional electrical performance and mechanical stability.
The XtremeSpeed™ RO1200 Bondply is an advanced, extremely low-loss, ceramic-filled, non-glass reinforced PTFE bonding material developed by Rogers Corporation. It is engineered for high-speed digital applications, offering exceptional electrical and mechanical performance.