The RO4000® Series Laminates, including RO4003C™, RO4350B™, and RO4835™, are high-performance circuit materials designed for RF, microwave, and high-speed digital applications. This document outlines product details, safety information, and usage considerations.
The RO4000® series laminates, including RO4003C™, RO4350B™, and RO4835™, are high-performance materials designed for RF and microwave applications. They combine superior electrical properties with processability similar to traditional FR-4 materials. Below are the recommended fabrication guidelines for achieving optimal performance and reliability.
RT-Duroid laminates, including PTFE-based composites like RT-Duroid 5870 and 5880, are widely used in high-frequency applications due to their excellent dielectric properties. However, in specialized environments such as space exploration, nuclear facilities, or medical applications involving ionizing radiation, understanding the impact of nuclear radiation on these materials is crucial.
The RT-Duroid 5870-5880 laminates, made from glass microfiber-reinforced PTFE, offer a nearly isotropic dielectric constant, which provides several key advantages for high-frequency circuit applications.
RT-Duroid® 5880 is a PTFE-based composite laminate reinforced with fiberglass, designed for high-frequency applications. This safety data sheet provides essential information for safe handling, storage, and disposal.
RT-Duroid® 5880 ist ein Hochleistungs-Laminat aus PTFE-Verbundwerkstoffen, das in Hochfrequenz- und Mikrowellenanwendungen weit verbreitet ist. Dieses Sicherheitsdatenblatt enthält wichtige Informationen zur sicheren Handhabung, Lagerung und Entsorgung.
Polytetrafluoroethylene (PTFE) composite materials, such as those used in high-performance laminates like RT-duroid®, offer exceptional properties for electronic applications. However, their unique chemical composition and processing requirements necessitate adherence to specific safety guidelines.
RT-duroid® 5880 laminates are high-performance circuit materials designed for high-frequency applications requiring low dielectric constant, low loss, and excellent stability. These laminates are widely used in aerospace, defense, and telecommunications applications.
Line Widths for Various Characteristic Impedance of Center Stripline Devices in RT-Duroid® Laminates
Stripline configurations are widely used in high-frequency circuit designs due to their excellent shielding and predictable impedance characteristics. The determination of line widths for achieving specific characteristic impedances in RT-duroid® laminates requires accurate calculations based on material properties and geometry.
Creep is the slow, time-dependent deformation of materials under mechanical stress, which can lead to reliability issues in printed circuit board assemblies (PCBAs). It becomes particularly significant at elevated temperatures or under constant stress