In order for silicon to turn into a semiconductor chip, it needs to go through the several complex process of wafer manufacturing, oxidation, photolithography, etching, deposition and ion implementation, metal wiring, Eds and packaging.
Summary: High-frequency microwave plates should be a new product of high-tech. With the continuous development of communications and computers towards high frequency and high speed, their uses will become wider and wider in the future
Excellent layer stacking is the key to ensure bypass and decoupling of the power bus, minimize transient voltage on the power layer or ground layer, and shield the electromagnetic field of the signal and power supply.
Changes in operating temperature environments are not always predictable, but they can be anticipated, especially for electronic applications that are exposed to outdoor temperatures and heat sources. Starting from the system’s circuit board, temperature effects can cause costly changes in circuit performance
Circuit pattern changes and minor anomalies are usually acceptable for low-frequency circuits, but the performance of millimeter-wave circuits is sensitive to circuit pattern changes and minor circuit anomalies
Circuit materials rely on high-quality conductors and dielectric materials to connect modern complex components to each other for optimal performance. However, these PCB copper conductors, whether DC or millimeter wave (mmWave) PCB boards, need protection against aging and oxidation
High-frequency boards are the basis for the realization of microstrip circuit engineering. In the process of microstrip circuit design, sometimes the original design boards are out of stock, or it is necessary to use more reliable high-frequency boards for circuit design
Multilayer circuits occupy more vertical space than horizontal space, allowing designs to be stacked in a compact space. The number of layers in a circuit refers to the number of conductor layers in the circuit, usually separated by dielectric layers
5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module
The electronics industry has undergone many changes over the past few years. Nowadays, millimeter wave radar and millimeter wave communication frequently appear in our sight. In particular, Huawei has made remarkable achievements in 5G, and millimeter wave technology has been put on the table. Why does millimeter wave technology play such a key role in 5G and smart cars? Next, let’s take a closer look at the past and present of millimeter wave technology and its continuation.