PCB Processing The precise dimensions required for millimeter-wave circuits demand well-controlled PCB processing techniques to produce circuits with consistently excellent performance. Variations in copper plating thickness and final surface treatment on the conductor surface can impact the performance of millimeter-wave circuits. To ensure the successful fabrication of high-performance millimeter-wave circuits, both of these processes must […]
From anti-collision radar systems used in autonomous vehicles to the fifth-generation (5G) high data rate New Radio (NR) networks, the application of millimeter-wave (mmWave) circuits is growing rapidly. Many applications are pushing the operating frequency bands to higher frequencies (such as >24GHz).
Printed Circuit Boards (PCBs) are a fundamental component in electrical engineering. They are used to create electronic circuits by arranging components such as transistors and resistors on a copper-based wiring pattern on the surface of an insulator (typically plastic) and then soldering them.
RO4000® hydrocarbon ceramic laminates are designed to off er superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes off ered at competitive prices. The selection of laminates typically available to designers is signifi cantly reduced once operational frequencies increase […]
One of the two most common methods of attaching electronic components to PCBs is the through-hole or through-hole process. This technology is older than SMT, and for many years, it was the standard technology for PCB assembly. When surface mount technology became popular in the 1980s, many people thought it would make through-hole PCB assembly obsolete. However, through-hole technology has several advantages that make it still a preferred choice for certain applications.
Basic soldering guide on how to solder electronic components to a printed circuit board (PCB). This is a detailed and complete soldering guide for both automated soldering in mass production and manual soldering in PCB rework and repair.
SMT vs. Through-Hole – Disadvantages of SMT vs. Through-Hole
Since not all basic electronic components are available for surface mounting, the actual area savings on the board will depend on the percentage of through-hole components replaced by surface mount components. The three types of surface mount offer varying degrees of benefit depending on the component combination.
SMD soldering or surface mount technology assembly requires different SMT equipment and more experience and expertise. SMT PCBs have flat tin-lead or gold-plated copper pads without any holes. These traces are called “pads
The lower thermal resistance between the BGA package and the PCB components is another advantage of this type of package. This allows heat to flow more freely, resulting in better heat dissipation and preventing the device from overheating.
Surface Mount Technology (SMT) is widely used in the PCB assembly process, but like any complex manufacturing technology, it is not immune to defects. Whether you’re dealing with solder balls, bridging, tombstoning, or unmelted solder paste, troubleshooting is a key part of ensuring high-quality SMT production.