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PCB Manufacturing

Innovative printing solutions for front-end RF module packaging

5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module

PCB Manufacturing Engineering Technology

An article that looks at the past and present of millimeter waves: Why 5G and smart cars cannot do without millimeter wave technology

The electronics industry has undergone many changes over the past few years. Nowadays, millimeter wave radar and millimeter wave communication frequently appear in our sight. In particular, Huawei has made remarkable achievements in 5G, and millimeter wave technology has been put on the table. Why does millimeter wave technology play such a key role in 5G and smart cars? Next, let’s take a closer look at the past and present of millimeter wave technology and its continuation.

Engineering Technology PCB Manufacturing

Overview of PCB high-frequency board material selection and production and processing methods

Difficulties in high frequency board processing

1. Copper deposition: It is not easy to copperize the hole wall
2. Control of line gaps and sand holes in pattern transfer, etching, line width
3. Green oil process: control of green oil adhesion and green oil bubbling
4. Strict control of board scratches in each process, etc.