Over 10 years we help companies reach their financial and branding goals. Engitech is a values-driven technology agency dedicated.

Gallery

Contacts

411 University St, Seattle, USA

engitech@oceanthemes.net

+1 -800-456-478-23

Twitter Facebook-f Pinterest-p Instagram
PCB Design/Layout PCB Manufacturing
Multilayer PCBs
_ _ Eleanor_ 0 Comments

Multilayer PCB Manufacturing Process, Advantages and Applications

A Multilayer PCB (Printed Circuit Board) is a type of PCB with more than two conductive layers. Unlike a double-sided PCB, which has two copper layers (top and bottom), a multilayer PCB consists of three or more layers of copper, interconnected by copper-plated vias. The number of layers can range from 3 layers to 40 layers or more, depending on the design requirements

LEARN MORE ♥7
PCB Manufacturing PCB Assembly PCB Design/Layout
PCB Substrate Materials
_ _ Eleanor_ 0 Comments

PCB Substrate Materials: Understanding the Types of PCB Materials

PCB (Printed Circuit Board) substrate materials are the backbone of a PCB assembly, providing the necessary foundation for copper tracks and electronic components. The choice of PCB material plays a critical role in determining the performance, durability, and overall reliability of the PCB. These materials can be resin-based, fiberglass-based, epoxy-glass, metal-based, or flame-retardant, and they are selected based on the specific requirements of the PCB design and its application.

LEARN MORE ♥1
PCB Manufacturing PCB Assembly PCB Design/Layout
PCB Substrate and Core Materials
_ _ Eleanor_ 0 Comments

PCB Substrate and Core Materials: A Comprehensive Guide

The Printed Circuit Board (PCB) is a fundamental component in all modern electronics, providing the platform for the electronic components and circuits. The performance, durability, and overall quality of a PCB are heavily influenced by the materials used for its substrate and core. This comprehensive guide explores the different types of PCB substrate and core materials, their properties, applications, and why they are important for engineers, PCB manufacturers, and students.

LEARN MORE ♥1
PCB Manufacturing PCB Assembly PCB Design/Layout
Surface Mount Technology (SMT) and Through-Hole Technology (THT) are two key PCB assembly methods widely used in electronics manufacturing. Both technologies have their own distinct advantages, applications, and processes. In this article, we will explore the differences between SMT and THT, examining the assembly steps, key features, and when each technology is ideal for use. What is SMT (Surface Mount Technology)? Surface Mount Technology (SMT) is a method for mounting electronic components directly onto the surface of a PCB (Printed Circuit Board). In SMT, specialized machines place small, lightweight components called Surface Mount Devices (SMDs) on a circuit board, which are then soldered using automated processes. SMT Process Steps: Solder Paste Application: Solder paste is applied to the PCB pads using a stencil. Component Placement: Automated pick-and-place machines place SMD components on the solder paste-covered pads. Reflow Soldering: The PCB is passed through a reflow oven, where heat melts the solder paste, bonding the components to the board. Inspection and Testing: Automated Optical Inspection (AOI) checks for defects, followed by functional testing. SMT vs. SMD: What's the Difference? SMT (Surface Mount Technology) refers to the process of mounting components directly onto the surface of the PCB. SMD (Surface Mount Devices) are the components that are used in the SMT process. Aspect SMT (Surface Mount Technology) SMD (Surface Mount Device) Definition Technology for mounting components on a PCB Components mounted using SMT Function PCB assembly process Physical components (ICs, resistors, capacitors, diodes, etc.) Size Small, thin, compact components Small, thin, and compact Automation Fully automated process Components suitable for automation What is THT (Through-Hole Technology)? Through-Hole Technology (THT) is a PCB assembly process where the leads of electronic components are inserted into pre-drilled holes in the PCB and soldered on the opposite side. This method is typically used for larger components like connectors, transformers, and capacitors. THT Process Steps: Component Insertion: Component leads are inserted through the drilled holes in the PCB. Wave Soldering or Manual Soldering: The components are soldered either through wave soldering or by hand. Inspection and Testing: Similar to SMT, the board is inspected for defects, followed by functional testing. SMT vs. THT: Key Differences Feature SMT (Surface Mount Technology) THT (Through-Hole Technology) Component Size Small SMD components Larger components with leads Board Complexity Suitable for high-density boards More suitable for simple PCB designs Assembly Speed Faster (automated) Slower (manual or semi-automated) Strength Lower mechanical strength Higher mechanical strength Cost Lower assembly cost Higher assembly cost Design Flexibility More flexible for compact designs Limited flexibility due to drilling Suitable Applications Consumer electronics, wearables Industrial, military electronics Repairability More challenging to repair Easier to repair and modify SMT vs. THT: Advantages and Disadvantages Advantages of SMT: Compact Design: SMT allows for smaller, more compact PCB designs, making it ideal for modern electronic devices like smartphones, tablets, and wearables. Fast Production Speed: The automation involved in SMT makes it faster and more cost-effective for large-scale manufacturing. Lightweight: SMT components are smaller and lighter, reducing the overall weight of the product. Disadvantages of SMT: Difficulty in Repair: SMT components are smaller and more difficult to repair or replace, requiring specialized tools. Less Durability: SMT boards tend to be less durable under mechanical stress when compared to THT boards. Advantages of THT: Strong Mechanical Strength: THT provides a stronger bond between components and the PCB, making it ideal for applications requiring high durability, like industrial equipment and military electronics. Ease of Repair: Due to the larger size of THT components and the accessible solder joints, it is easier to repair or replace components. Disadvantages of THT: Slower Process: THT is slower due to the manual or semi-automated insertion and soldering process. Bulky Design: THT components are larger, which can make it difficult to design compact, high-density PCBs. Which PCB Assembly Technology is Better: SMT or THT? The choice between SMT and THT depends on the specific needs of the product and its intended application. SMT is the better choice for projects that require high-density circuits, fast assembly, and compact design, such as for smartphones, tablets, and wearables. THT is ideal for applications that demand mechanical strength, durability, and easy repair, such as for industrial electronics, military equipment, and automotive systems. In cases where both SMD and through-hole components are required, hybrid PCB assembly using selective soldering can be employed to combine the advantages of both technologies. Conclusion Both SMT and THT have their distinct advantages, and choosing the right technology depends on factors like design complexity, production speed, component size, and durability requirements. By understanding the differences between the two technologies, manufacturers can optimize their PCB assembly process for a wide range of applications.
_ _ Eleanor_ 0 Comments

SMT vs THT PCB Assembly Process: Difference Analysis

Surface Mount Technology (SMT) and Through-Hole Technology (THT) are two key PCB assembly methods widely used in electronics manufacturing. Both technologies have their own distinct advantages, applications, and processes. In this article, we will explore the differences between SMT and THT, examining the assembly steps, key features, and when each technology is ideal for use.

LEARN MORE ♥1
PCB Manufacturing PCB Assembly PCB Design/Layout
PCBA boards
_ _ Eleanor_ 0 Comments

Advanced PCBs – Design, Manufacturing, and Assembly

Advanced PCBs are complex multi-layer printed circuit boards (PCBs) with significantly more layers than standard multi-layer boards. These advanced PCBs are crucial for high-end, high-precision electronic devices, which are typically found in industries like industrial equipment, instrumentation, automotive electronics, aviation, military applications, communication systems, complex computing, and space technology.

LEARN MORE ♥
PCB Assembly PCB Design/Layout PCB Manufacturing
Overview of SMD Components and Their Characteristics
_ _ Eleanor_ 0 Comments

Overview of SMD Components and Their Characteristics

SMD (Surface-Mount Device) components and SMT (Surface-Mount Technology) stickers serve the same electrical functions. However, due to their small size, SMD components offer better electrical performance. Despite these advantages, not all components are available for surface mounting. High-end processors and large connectors like BGAs (Ball Grid Arrays) and PGAs (Pin Grid Arrays) often require mixed assembly modes due to their unique requirements.

LEARN MORE ♥1