BGA is a surface mount component that is used for chip design ICs. The full name of BGA is ball grid array. Therefore, it has many balls in the form of an array. Generally, BGA is used for chip design PCBs such as microprocessors and integrated ICs
BGA assembly refers to the process of attaching a ball grid array (BGA) to a circuit board using a solder reflow process. BGAs are surface mount components that use an array of solder balls to create electrical interconnections between components and PCBs
When it comes to assembling Printed Circuit Boards (PCBs), there are two primary technologies: Surface Mount Technology (SMT) assembly and Through-Hole Technology (PTH) assembly
Printed circuit board (PCB) assembly is at the heart of electronic components and gadgets. Designers typically choose between two primary techniques for mounting components on PCBs: SMT (Surface Mount Technology) and PTH (Plated Through Hole).
The introduction of phenolic resin-based laminates in the 1930s improved mechanical stability and insulation. However, the game-changer was the development of glass-reinforced epoxy laminates (FR-4) in 1940, offering superior electrical insulation, moisture resistance, and mechanical durability.
A PCB is a substrate or laminate that supports and connects electronic components to enable various device functionalities. Common substrates include FR4 (flame retardant material), but there are alternatives such as polyimide for flexible designs. PCBs are categorized by layers—single-sided, double-sided, and multi-layer—and by substrate type (rigid, flexible, or rigid-flex combinations)
Surface Mount Technology (SMT) board assembly is a critical and widely used process in modern PCB manufacturing. This process involves placing and soldering electronic components directly onto the surface of PCB pads.
Surface mount technology is a method of assembling electronic components onto a printed circuit board (PCB). Unlike traditional through-hole technology, where the leads of the component are inserted through holes in the PCB, SMT involves mounting the component directly onto the surface of the PCB. SMT offers advantages such as smaller size, higher manufacturing efficiency, and compatibility with automated assembly processes.
SMT, the short form of Surface Mount Technology, a type of PCB (Printed Circuit Board) assembly technology, refers to the technology of getting components directly soldered onto the surface of PCB to replace THT (Through-Hole Technology) that has to make use of drilling holes
Thin film resistors have a metallic film that is vacuum deposited on an insulating substrate. Thick film resistors are produced by firing a special paste onto the substrate. The paste is mixture of glass and metal oxides. Thin film is more accurate, has better temperature coefficient and is more stable.