High-Frequency PCB is a subcategory in the field of PCB that is designed with extremely high electromagnetic frequencies. The typical frequency of high-frequency PCB is about 16 Ghz or higher.
A printed circuit board, commonly known as a PCB, is an assembly that uses copper conductors and electricity to create electrical connections between electrical components. PCB manufacturers use a substrate to make it, which houses the components that form the basis of the PCB. PCBs are made of a variety of substrate materials, depending on the requirements of the circuit.
Flexible PCB is a unique type of printed circuit board that replaces the rigid FR4/metal/PTFE/ceramic substrate with a thin, bendable polyimide (PI) substrate and replaces the solder mask with a PI coverlay. Plated through holes or buried vias insulate and protect the conductive copper traces that connect the various flexible PCB layers to the non-conductive PI material. Flexible circuit board, flexible PCB or FPC is another name for flexible PCB.
China, as the world’s largest automotive market, has positioned itself as a formidable force in the field of autonomous driving technology. With over 160 OEM manufacturers and a rapidly growing electric vehicle (EV) sector, the nation’s drive toward intelligent mobility is accelerating. This blog explores the current state of autonomous driving technology in China, highlighting key players, technological advancements, and the unique strengths that position China as a global leader in this field.
In the fast-paced world of technology, printed circuit boards (PCBs) quietly protect the functionality of electronic devices. In addition to connecting components, PCB assembly is also critical to protecting against potential threats.
BGA is a surface mount component that is used for chip design ICs. The full name of BGA is ball grid array. Therefore, it has many balls in the form of an array. Generally, BGA is used for chip design PCBs such as microprocessors and integrated ICs
BGA assembly refers to the process of attaching a ball grid array (BGA) to a circuit board using a solder reflow process. BGAs are surface mount components that use an array of solder balls to create electrical interconnections between components and PCBs
When it comes to assembling Printed Circuit Boards (PCBs), there are two primary technologies: Surface Mount Technology (SMT) assembly and Through-Hole Technology (PTH) assembly
Printed circuit board (PCB) assembly is at the heart of electronic components and gadgets. Designers typically choose between two primary techniques for mounting components on PCBs: SMT (Surface Mount Technology) and PTH (Plated Through Hole).
The introduction of phenolic resin-based laminates in the 1930s improved mechanical stability and insulation. However, the game-changer was the development of glass-reinforced epoxy laminates (FR-4) in 1940, offering superior electrical insulation, moisture resistance, and mechanical durability.