Shenzhen KKPCB Technology Co., Ltd. (KKPCB) is a professional PCB and PCBA manufacturer dedicated to providing one-stop electronic manufacturing solutions. Specializing in high-difficulty, small to medium batch PCB and PCBA production, we focus on delivering high-precision, high-reliability products with fast turnaround times to meet customers’ complex design and technical requirements.

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05, 258 Shenshan Rd, Longdong Community, Baolong St, Longgang Dist, Shenzhen, China

+86-177-4855-1367

Engineering Technology

Pressure Sensor PCBA Solution Case Study for Industrial Control Equipment

1.Background Overview

A client from Europe, engaged in the development of industrial automation systems, required integration of a high-precision pressure sensor module in their next-generation process control system. The module needed to detect subtle changes in gas or liquid pressure in real time to enable dynamic control and safety alerts.

Given the complex environment in which the equipment would operate, the client emphasized strict standards for PCB heat resistance, soldering reliability, and circuit stability.

KKPCB was selected as the PCBA manufacturing partner for this project due to our rich experience in industrial control applications and our proven ability to deliver high-reliability solutions.

Engineering Technology
laptop-rugged PCB product

KKPCB Manufacturing Case: Mass Production Solution for Military-Grade Rugged Computer PCBs

Industry: Defense Electronics
End Applications:
Armored vehicle main control units
Field communication relay equipment

Manufacturing Challenges:
Heterogeneous material processing (AlSiC metal substrate + FR4 multilayer hybrid lamination)
Extreme environment reliability (MIL-STD-810H vibration compliance)

Military-grade quality control (100% inspection + batch traceability)

Previous Supplier Pain Points:
✔ AlSiC substrate yield only 65% (delamination due to CTE mismatch)
✔ PCIe gold finger contact failure rate 3,000 PPM (post-vibration)
✔ EMP shielding layer vacuum lamination yield below 80%

Engineering Technology

Satellite IoT Dual-Mode Communication PCB: High-Reliability Design for Harsh Environments

(ASTM E1647 Validated, 60% Cost Reduction vs. Ceramic Substrates) Project Introduction This project developed a mission-critical PCB for commercial satellite IoT terminals requiring: “The Rogers/Taconic hybrid stackup solved our insertion loss and CTE mismatch problems simultaneously.”— Lead RF Engineer (Client R&D Team) Key Specifications Parameter Target Achieved Frequency Range 902-928MHz (LoRa) + 1.5GHz (SatIoT) 850MHz-1.6GHz […]

Engineering Technology

KKPCB Case Study: 77GHz Automotive Radar PCB

1. Customer Profile Client: AnonymousIndustry: ADAS (Advanced Driver Assistance Systems), Autonomous VehiclesApplication: 77GHz Long-Range Radar (LRR) for Highway Pilot & Collision Avoidance Customer’s Requirements: Key Challenges: 2. KKPCB’s Radar PCBA Solution (A) Material & Stackup Layer Material Function Key Specs RF Layers Rogers RO3003 Antenna Array & Front-End Dk=3.0, Df=0.0013 @ 77GHz Core Arlon 25FR […]

Engineering Technology

Case Study: Medical Ventilator High-Precision Pressure Sensor PCBA Solution

1️⃣ Background Overview Global medical equipment is accelerating its intelligentization, and the requirements for the accuracy and reliability of pressure sensors in ventilators continue to increase. A Middle Eastern medical equipment manufacturer plans to upgrade its ventilator airway control system, which requires a differential pressure sensor module that can operate stably in a high temperature and […]

Engineering Technology
KKPCB Case Study: Hybrid Power+RF PCB for Base Station Applications

KKPCB Case Study: Hybrid Power+RF PCB for Base Station Applications

Client: Anonymous
Industry: Telecom Infrastructure, 5G Macro/Micro Base Stations
Application: Power Amplifier (PA) Modules + RF Front-End PCBs

High-power base station equipment requiring PCBs are able to handle:

High current (30A+) for PAs

Low-loss RF (3.5GHz-28GHz for 5G)

Thermal stability (85°C ambient, 125°C local hotspots)

Key Challenges Faced:

Delamination risk from mixed thick-copper (6oz) and RF layers.

EMI coupling between power and RF sections.

Thermal warping under high thermal cycling.

Engineering Technology

KKPCB Case Study: High-Frequency Fiber Optic Transceiver PCB for Fiber Instrument Sales

Client:  Anonymous
Industry: Fiber Optic Test & Measurement, High-Speed Data Transmission
Application: Next-gen 100G/400G+ optical transceivers, OTDR equipment, and 50GHz RF test modules.

FIS designs precision fiber optic tools, requiring ultra-low-loss PCBs to maintain signal integrity at millimeter-wave frequencies (up to 50GHz). Their challenges include:

Insertion loss degrading high-speed signals (>40Gbps).

Impedance mismatches causing reflection noise.

Thermal expansion leading to microvia cracking in compact designs.

Engineering Technology

Optimizing Small Wind Turbine Inverters: Enhancing Stability & Reliability

Optimizing Small Wind Turbine Inverters: Enhancing Stability & Reliability Customer Background & Market Demand Germany is a global leader in renewable energy, with its Energiewende (energy transition) policy driving widespread adoption of distributed wind power for rural electrification, industrial parks, and off-grid energy solutions. Small Wind Turbines (SWTs) have become an essential power supply option […]