When discussing wiring-related technologies, two issues will be discussed: What if management cannot use a double-layer board or a ground plane, but still needs to reduce the noise in the circuit? And how to design the circuit to meet the ground plane requirements? Generally speaking, the solution is to tell management that a ground plane is necessary if reliable circuit performance is to be achieved. The main reason for using a ground plane is that the ground impedance is low and it can reduce EMI to a certain extent. But if cost constraints prevent users from achieving what they need, some suggestions provided in this article, such as star networks and correct current return paths, can also slightly reduce circuit noise.
24GHz radar detection system mainly supports short-range detection (SRR), high frequency circuit board and high wavelength. Applicable boards: RO4835, RO4350B, RO4003C . Among them, RO4350B nitride ceramic laminate and RO4835 nitride ceramic laminate are highly recommended. These two series belong to the cost-effective series for people’s daily use.
High-frequency PCB is a special circuit board with a higher electromagnetic frequency, which is above 1GHz. The physical properties, precision and technical parameters of high-frequency PCB are very high, and it is often used in radar, military equipment, aerospace and other fields.
RO4000 series laminates can be processed using standard FR-4 techniques without specialized via preparation. They are rigid, thermoset laminates, compatible with automated systems and scrubbing equipment for copper surface preparation. RO4835 laminates are RoHS compliant and suitable for UL 94V-0 certified applications.
RO4000 hydrocarbon ceramic laminates are designed to offer superior high frequency PCB performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes offered at competitive prices.
This study was conducted to evaluate dimensional movement of Rogers RO4350B
Product through the circuit fabrication process. The study was conducted using Six
Sigma tools and the DMAIC process as a guideline for the evaluation (Define, Measure,
Analyze, Improve, and Control). The Six Sigma project was initiated as a joint exercise between Rogers Corporation and printed circuit board manufacturer Cirtech Inc.
Frequently, designers are concerned about temperature rise of the conductor traces on devices built in microstrip or stripline configurations on RT/duroid® microwave material. The question arises when there are high bias line currents, but the bias line needs to be as narrow as possible to keep its characteristic impedance high. It also is of concern when RF power levels are high.
Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design.
These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4003C™, RO4350B™ and RO4835™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.
RO3003, RO3003G2, RO3006 and RO3010 copper clad laminates are filled PTFE composites offering excellent thermal reliability and electrical performance over a range of dielectric constants. RO3000 series materials provide the homogeneity of properties that are expected of unreinforced materials.