As electronic products become more advanced, they encounter more sources of electromagnetic interference (EMI) that can disrupt device function and potentially harm health. This guide explores strategies for designing PCB boards with optimized electromagnetic compatibility (EMC), focusing on reducing interference and increasing product resilience.
Electrostatic Discharge (ESD) can damage sensitive components such as MOSFETs, CMOS gates, and PN junctions, leading to issues like gate damage, short circuits, and even melted wiring. This guide offers practical strategies to design PCBs that effectively prevent ESD from harming the circuit.
Before explaining the inspection work after PCB wiring is completed, we will first introduce three special PCB routing techniques. The routing of PCB LAYOUT will be explained from three aspects: right-angle routing, differential routing, and serpentine routing
Grounding is fundamental in electronic circuit design, influencing stability, noise immunity, and overall performance. Grounding techniques range from basic single-loop analog grounding to advanced grounding methods for complex mixed-signal designs. These techniques become increasingly critical in high-frequency or high-EMC (Electromagnetic Compatibility) environments. Here’s a comprehensive overview of grounding techniques and methods for reducing ground loops to enhance stability.
By following these guidelines—such as optimizing trace width, minimizing via use, and ensuring proper documentation for manufacturing—you can significantly improve the performance, reliability, and manufacturability of your PCB designs.
Open circuits in PCBs can often be traced back to mechanical damage during various stages of production—whether from scratched copper clad laminate, improper handling, or worn tools. Implementing the outlined improvement methods can significantly reduce the occurrence of these issues, improving both product quality and production efficiency.
Understanding these common misunderstandings in circuit design is essential for engineers who want to improve efficiency, reduce power consumption, and design more reliable systems. By addressing these myths, you can avoid co
In circuit board manufacturing, various electroplating methods are employed to enhance performance, durability, and contact quality. This article focuses on four specialized electroplating methods commonly used in PCB (printed circuit board) welding processes
It is generally recommended to use the method of automatic routing + manual adjustment. Automatic routing requires routing in the order of ground line – power line – clock line – others. Set the routing priority in the routing rules, 0 is the lowest level, 100 is the highest level, and there are 101 situations in total. In more complex circuit boards, considering the requirements of electrical characteristics, interference and other factors, we all use manual routing. It is forbidden to place vias on the pins of components, and the already routed lines should be locked before automatic routing. The routing should take into account both aesthetics and electrical characteristics. In particular, the routing that affects the appearance should be routed on the reverse side. In principle, do not route the front side of the product name, model and Zhongyou logo (except in special cases), and do not allow front routing between the silk screen frame and the Keepout frame (except in special cases).
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