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411 University St, Seattle, USA

engitech@oceanthemes.net

+1 -800-456-478-23

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Capabilities

Rigid PCB + HDI Process Capability
Layer Count
1-40 Layers
Board Material Type
FR-4 Material, High Frequency Material, High Speed Material, Metal Substrate Material
Layer Stacking
(Rogers, PTFE) + FR4
Material Brand
ITEQ, Shengyi, TUC, Nan Ya, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, etc.
Board Thickness Range
0.2mm-8.0mm
Board Thickness Tolerance
Standard Tolerance: ±0.1mm (Thickness ≤1.0mm), ±10% (Thickness >1.0mm)
Outer Layer Copper Thickness
0.33oz-14oz
Inner Layer Copper Thickness
0.5oz-12oz
Laser Hole Diameter
0.075mm-0.15mm
Minimum Hole Diameter
0.1mm
Back Drilling Hole Diameter
0.2mm
Back Drilling Stub
0.05mm-0.25mm
Minimum Resin Plug Hole Diameter
0.15mm
Number of Laser Passes
1-5 Passes (Review for ≥6 Passes)
Line Width/Spacing (Minimum)
2/2mil
Impedance Accuracy
Standard Tolerance: ±10% (<50Ω), ±10% (≥50Ω)
Aspect Ratio (Plated Through Hole)
25:1
Aspect Ratio (Laser Drilled)
1:1
Maximum Finished Size
1500*620mm
Minimum Finished Size
2.0mm*2.0mm
Minimum BGA Pitch
0.35mm
Outline Tolerance
±0.1mm
Solder Mask Color
Green, Matte Green, Black, Matte Black, Yellow, Red, Blue, White
Surface Treatment
Immersion Gold, Hard Gold Plating, Gold Finger Plating, Lead-Free HASL, HASL, OSP, Electroless Nickel/Immersion Gold, Soft Gold Plating (with/without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+Galvanic Ferrite, Full Board Gold Plating+Galvanic Ferrite, Silver Plating+Galvanic Ferrite, Tin Plating+Galvanic Ferrite
Capability for Rigid-Flex PCB Board Manufacturing Process
Reinforcement Type
PI, Steel Plate, FR4
Flexible Substrate
SF305, RF-775, DuPont AP
Inner Layer Copper Thickness
≤2oz
Rigid Substrate
IT-180A, S1000-2, TU-768, 85N, RO4350B Series, VT-901, R-5775, TU-872SLK, TU-862HF
Outer Layer Copper Thickness
≤3oz
Flex-Rigid Structure
1st Order HDI, 2nd Order HDI; Flying Tail Type Rigid-Flex Board (≤20 Layers)
Rigid Area
2-20 Layers
Flexible Area
1-8 Layers