| Number of layers | 1-40 layers | Board thickness | 0.2mm-8.0mm |
| Board material type | FR-4 Material, High Frequency Material, High Speed Material, Metal Backed Material | Board Thickness (Tolerance) | Standard tolerance: ±0.1mm (Thickness ≤1.0mm), ±10% (Thickness >1.0mm) |
| Layers | (Rogers, PTFE) + FR4 | Thickness of outer layer copper | 0.33oz-14oz |
| Brand of material | ITEQ, Shengyi, TUC, Nan Ya, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, etc. | Thickness of copper of inner layer | 0.5oz-12oz |
| Laser hole diameter | 0.075mm-0.15mm | Minimum hole diameter | 0.1mm |
| Back drilling hole diameter | 0.2mm | Back drilling clearance | 0.05mm-0.25mm |
| Minimum hole diameter for resin filling | 0.15mm | Number of laser passes | 1-5 passes (consideration for ≥6 passes) |
| Line width/distance (minimum) | 2/2mil | Impedance accuracy | Standard tolerance: ±10% (<50Ω), ±10% (≥50Ω) |
| Aspect Ratio (Through Hole) | 25:1 | Aspect Ratio (Laser Drilling) | 1:1 |
| Maximum finished board size | 1500*620mm | Minimum finished board size | 2.0mm*2.0mm |
| Minimum BGA pitch | 0.35mm | Contour tolerance | ±0.1mm |
| Solder mask color | Green, Matte Green, Black, Matte Black, Yellow, Red, Blue, White |
| Surface coating | Immersion Gold, Hard Gold Plated, Contact Gold Plated, Lead Free HASL, HASL, OSP, Electroless Nickel/Immersion Gold, Soft Gold Plated (with/without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+Electroplated Ferrite, Full Gold Plated+Electroplated Ferrite, Silver Plated+Electroplated Ferrite, Tin Plated+Electroplated Ferrite |
