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PCB Material Specification Sheet
ROGERS

PSIS – RT-duroid 6010-6006 Microwave Laminate

RT-Duroid® 6010 and 6006 laminates are engineered for high-frequency and microwave applications. These materials are composed of ceramic-filled polytetrafluoroethylene (PTFE), providing excellent electrical and mechanical stability. Their high dielectric constants enable miniaturization of circuit components, making them ideal for compact and efficient designs.

PCB Material Specification Sheet
ROGERS

Line Widths for Various Characteristic Impedance of Center Stripline Devices in RT duroid Laminates

RT-Duroid® laminates are widely used in microwave and high-frequency circuit applications due to their stable dielectric properties and low loss tangent. Designing stripline devices with specific characteristic impedances involves determining the appropriate line width, which depends on the laminate’s dielectric constant (Dk), thickness, and copper cladding.

PCB Material Specification Sheet
ROGERS

Fabrication Guidelines RT-duroid 6002-6006-6010 High Frequency Circuit Materials

RT-Duroid® 6002, 6006, and 6010 laminates are advanced materials designed for high-frequency and microwave applications, offering low dielectric constant (Dk) variability, low loss tangent (Df), and excellent thermal and mechanical stability. These guidelines provide best practices for fabricating circuits using these materials to ensure optimal performance and reliability.

PCB Material Specification Sheet
ROGERS

After Etch Stress Relief in RT-duroid Microwave Laminates

RT-Duroid® microwave laminates are engineered for high-frequency applications where performance and reliability are critical. During the manufacturing process, mechanical and thermal stresses can be introduced, particularly after etching. Proper stress relief is crucial to maintain dimensional stability, adhesion, and electrical performance. This document outlines the significance of after-etch stress relief and best practices for its implementation.

Engineering Technology

Issues to Consider in the Production of High-Frequency Microwave Printed Circuit Boards (PCBs)

With the continuous development of high-frequency electronic devices, especially in wireless networks and satellite communications, information products are becoming faster and higher in frequency, and communication products are moving towards large capacity and high-speed wireless transmission for voice, video, and data standardization. As a result, the next generation of products requires high-frequency substrates. The process technology for high-frequency PCB production is continuously improving to meet the diverse needs of users. Based on over ten years of experience in PCB production, this article will detail the key technical aspects and considerations for the production of high-frequency microwave PCBs.