Summary: High-frequency microwave plates should be a new product of high-tech. With the continuous development of communications and computers towards high frequency and high speed, their uses will become wider and wider in the future
Excellent layer stacking is the key to ensure bypass and decoupling of the power bus, minimize transient voltage on the power layer or ground layer, and shield the electromagnetic field of the signal and power supply.
Key Takeaways
The competitiveness of new product introduction makes it critical to optimize your prototype design process for effectiveness and efficiency.
Your prototype PCB design software should exhibit essential attributes for managing component inventory, creating schematics, designing PCBs, verifying designs, and managing data.
OrCAD X delivers the essential functionality and capabilities in one program for prototype design optimization.
Key Takeaways
Understand the purpose of each component in a variable power supply, including transformers, rectifiers, capacitors, and regulators.
Learn about different topologies for variable power supplies, from discrete resistor selection to continuously variable potentiometer-based designs.
Discover how OrCAD X tools like DFM, interactive routing, constraint management, and thermal analysis can streamline the design and optimization of variable power supplies.
Key Takeaways
Stress during fabrication, such as thermal expansion and contraction, imbalanced copper distribution, and improper handling, can lead to warpage.
Utilize tools like feeler gauges, height gauges, contour gauges, optical profilometers, and Finite Element Method (FEM) simulations to accurately measure PCB warpage.
Effective design practices using OrCAD X, such as symmetrical component placement and proper copper distribution, combined with precise fabrication controls, can significantly reduce the risk of PCB warpage.
Maximize the efficiency of your design and manufacturing processes by optimizing your board development to mitigate the rigid flex PCB cost challenges
Key Takeaways
Cross-hatching significantly increases the flexibility of flex PCBs by reducing copper content.
Helps maintain optimal impedance in flex PCBs without altering dielectric thickness or signal line width.
Enables efficient manufacturing with reduced copper usage and improved resin adhesion.
OrCAD PCB Designer has the functionality to configure a 6-layer board, or any other type of PCB layer stackup to fit your exact needs
Key Takeaways
Defining two major concepts of board design and production: class and build.
An overview of the layout department’s responsibilities: library part generation as well as placement and routing.
Stepping more granularly through each task from schematic/design document reception to manufacturing files.
Changes in operating temperature environments are not always predictable, but they can be anticipated, especially for electronic applications that are exposed to outdoor temperatures and heat sources. Starting from the system’s circuit board, temperature effects can cause costly changes in circuit performance