Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design.
These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4003C™, RO4350B™ and RO4835™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.
RO3003, RO3003G2, RO3006 and RO3010 copper clad laminates are filled PTFE composites offering excellent thermal reliability and electrical performance over a range of dielectric constants. RO3000 series materials provide the homogeneity of properties that are expected of unreinforced materials.
Copper foils, for the wide range of Rogers’ high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.
As the demand for even more compact electronics grows, so does the need for ultra-thin flex PCBs. PCBs are essential to the development of compact electronics for mobile, implantable and other small devices.
HDI technology in printed circuit boards and other areas has been a critical driver for developing many of the electronics we use today, especially those that have decreased substantially in size and weight in recent years. The smaller the equipment gets, the more likely it is to employ HDI technology
At KKPCB, we’re your expert navigator through the world of stackup choices, ensuring your electronic arsenal is perfectly equipped. Need seamless integration with your design tools? Our impedance models make it effortless. Craft efficient, impedance-aligned PCB stackups that resist bowing and twisting, optimizing performance and reliability.
A flex PCB is essentially the same thing as a non-flex board except the flexible PCB uses a flexible base material to make its circuit connections. This is most helpful for products that will likely not be stationary devices.
In order for silicon to turn into a semiconductor chip, it needs to go through the several complex process of wafer manufacturing, oxidation, photolithography, etching, deposition and ion implementation, metal wiring, Eds and packaging.
Summary: High-frequency microwave plates should be a new product of high-tech. With the continuous development of communications and computers towards high frequency and high speed, their uses will become wider and wider in the future