This guide delves into the four fundamental characteristics of RF circuits—RF interface, small desired signals, large interference signals, and adjacent channel interference—and highlights essential considerations for PCB design.
Train personnel to consistently cut boards following the structural texture direction. If size variation persists, consider alternative substrate materials.
Work with laminate manufacturers to determine proper stress-relief processes before production.
Often, products come without a circuit schematic, making it challenging to understand the PCB’s functionality and design principles. When faced with such a situation, follow these steps to reverse-engineer and restore the circuit diagram. This guide provides detailed instructions for accurately translating a physical PCB back into a schematic diagram.
PCB manufacturing relies on standardized guidelines to ensure consistent quality and reliability across various applications. The following list covers the most widely recognized standards from the IPC, EIA, and JEDEC organizations, essential for quality assurance in PCB design, assembly, and testing.
Design for Manufacturability (DFM) optimizes designs for the manufacturing process, making it an essential component of concurrent engineering. By considering factors such as manufacturability and assembly requirements early in the design phase, DFM streamlines production, bridges CAD-CAM communication, and enhances product reliability. Here, we cover general technical requirements for DFM in PCB manufacturing.
Recently, I have been conducting ESD (Electro-Static Discharge) testing on various electronic products. From the test results, I realized that ESD is crucial: if the PCB design lacks proper ESD protection, static electricity can cause devices to freeze or even damage their components. Previously, I only understood that ESD could damage individual components, but now I see the importance of giving full attention to ESD protection throughout the entire design process.
When designing high-speed PCBs, process variations and other factors can significantly impact actual impedance. Automated design tools may not always detect these subtleties, making proactive, defensive design essential. Here’s how to address common challenges in high-speed PCB design.
Four-layer PCBs are typically used for high-density, high-frequency applications and offer more than 20 dB better electromagnetic compatibility (EMC) compared to two-layer boards. In a four-layer board setup, a complete ground plane and a full power plane can be used. This allows the various circuit ground wires to be connected to the ground plane effectively, with working noise managed separately.
In PCB design, circuit layout is fundamental for engineers. However, even experienced engineers may overlook critical details in basic PCB design, which can lead to errors. Sometimes, these errors may cause problems or even a complete failure of the circuit when converted into a PCB. To help engineers avoid redesigns and improve work efficiency, here are some essential aspects to consider during PCB design.
In PCB design, a well-designed circuit can still produce noise during testing, leading to performance issues or even requiring a board redesign. Below, we explore strategies to reduce circuit board noise effectively.