Low dielectric loss characteristics (tan δ) and low resistance conductors, low electrical loss, suitable for high-frequency applications
Due to our unique manufacturing technology, the size and characteristics of each production batch and within each batch vary little
High-density wiring is achieved by improving stacking alignment accuracy
Precise control of substrate thickness and cavity shape
Resistance, inductance, and capacitance functions are built into the substrate and package
LTCC (Low Temperature Co-fired Ceramic) is a special type of ceramic material that integrates multiple ceramic layers together through a co-firing process. With its unique performance advantages, LTCC has found widespread application in circuits and systems operating at microwave, millimeter-wave, and higher frequencies.
KKPCB provides global customers with one-stop services from PCB layout, prototype PCB proofing, PCB manufacturing, PCBA processing (including SMT and DIP), PCBA testing, PCBA product assembly and outbound packaging. You could provide a Gerber file or BOM list to us, we will offer the finished PCB products or PCB assembly which are satisfied with you
With the rapid development of high-speed circuit design, PCB routing has evolved beyond simple interconnection tasks. Engineers must analyze various distributed parameters using transmission line theory. Distributed parameter circuits account for spatial variations in voltage and current. Modern PCBs, with their complexity and density, include advanced features like microvias, buried/blind vias, and embedded components (e.g., resistors, capacitors). These advancements require PCB designers to understand production processes deeply and adapt their designs to manufacturing constraints.
PCB design requires understanding physical processes and careful organization of layers, power networks, and signal paths. Following these recommendations reduces noise risk, improves reliability, and simplifies the routing of complex systems
When designing high-speed PCBs, the layer stack-up plays a crucial role in ensuring signal integrity, minimizing crosstalk, and achieving optimal electromagnetic compatibility (EMC). For a standard six-layer board with a thickness of 1.6mm, selecting the right structure can significantly impact performance. Below is an analysis of common six-layer board structures and their suitability for high-speed designs
Impedance line routing in multi-layer PCBs is both an art and a science. Adhering to the principles of short lines, symmetry, equal length, and precise compensation ensures high-speed data transmission and robust device performance. By leveraging tools like the Polar Si9000 and applying best practices in design, engineers can effectively address challenges in modern PCB impedance routing.
Closely spaced vias are a common design challenge in multi-layer and high-speed PCB boards. Understanding the implications of tight spacing—such as drilling process inefficiencies, reduced solder ring size, and long-term reliability concerns—is essential. By adhering to recommended spacing guidelines, optimizing via placement, and collaborating with manufacturers, designers can enhance production yield, reduce costs, and ensure robust product per
Addressing power supply noise interference in PCB design involves a systematic approach to layout optimization, filtering, and grounding. By understanding the root causes of power supply noise and applying the countermeasures outlined above, designers can significantly enhance circuit performance and reliability. A clean power supply, well-isolated signal paths, and proper filtering are key to achieving a noise-resilient PCB.
In this context, ROGERS has introduced the RO4830™ material, which, with its excellent performance and lower cost, has become a key solution in driving the widespread adoption of 77 GHz millimeter-wave radar technology.