The introduction of phenolic resin-based laminates in the 1930s improved mechanical stability and insulation. However, the game-changer was the development of glass-reinforced epoxy laminates (FR-4) in 1940, offering superior electrical insulation, moisture resistance, and mechanical durability.
A PCB is a substrate or laminate that supports and connects electronic components to enable various device functionalities. Common substrates include FR4 (flame retardant material), but there are alternatives such as polyimide for flexible designs. PCBs are categorized by layers—single-sided, double-sided, and multi-layer—and by substrate type (rigid, flexible, or rigid-flex combinations)
Surface Mount Technology (SMT) board assembly is a critical and widely used process in modern PCB manufacturing. This process involves placing and soldering electronic components directly onto the surface of PCB pads.
RF PCB refers to a Radio Frequency Printed Circuit Board, operating within a frequency range of 100 MHz to 100 GHz. These specialized PCBs are integral to devices that rely on wireless communication for data transfer.
Flexible printed circuit boards (PCBs) are a cornerstone of modern electronics, found in devices like smartphones, cameras, and electric vehicles. Unlike traditional rigid PCBs made from FR4 (flame retardant material), flexible PCBs utilize polymer substrates such as polyimide, resulting in their signature amber or orange appearance
Motor driver ICs handle high currents and dissipate substantial heat, so efficient PCB design is essential to ensure proper heat dissipation and reliable performance. Below are some best practices for designing a robust PCB for motor driver ICs.
Flexible PCBs (printed circuit boards) provide the ability to bend and conform to various shapes, making them an essential technology for space-constrained and dynamic applications. A 2-layer flex PCB contains a flexible dielectric layer sandwiched between two conductive copper layers. Designing these PCBs requires unique considerations, including material selection, layout techniques, manufacturability, and reliability.
Flexible printed circuit boards (flexible PCBs or flex circuits) are made from flexible insulating materials such as polyimide film. Unlike traditional rigid PCBs, flexible PCBs can bend and twist while maintaining electrical connectivity, making them ideal for space-constrained and dynamic applications.
Surface mount technology is a method of assembling electronic components onto a printed circuit board (PCB). Unlike traditional through-hole technology, where the leads of the component are inserted through holes in the PCB, SMT involves mounting the component directly onto the surface of the PCB. SMT offers advantages such as smaller size, higher manufacturing efficiency, and compatibility with automated assembly processes.
The application of solder paste is one of the most crucial processes in the SMT assembly. This process requires careful attention and a high level of precision. This is because the main goal is to apply solder in the proper location and adequately. Therefore, it is important to carefully coat each pad using the appropriate amount of solder.