FR406N is a high-performance, low-loss FR-4 epoxy laminate and prepreg system designed for applications requiring superior thermal reliability, electrical performance, and mechanical stability. It is widely used in multilayer PCB designs, especially for high-speed digital circuits, RF/microwave systems, and aerospace electronics.
The FR406BC laminate system is a high-performance epoxy-based material optimized for advanced printed circuit boards (PCBs) requiring superior thermal reliability, mechanical strength, and electrical performance. Designed with a balanced CTE and excellent through-hole reliability, it is particularly suitable for multilayer PCBs, high-speed digital designs, and RF/microwave applications.
FR402 is a high-performance, tetrafunctional epoxy-based laminate and prepreg system designed for advanced multilayer PCB applications. With its enhanced thermal stability, low dielectric loss, and high glass transition temperature (Tg), it is an excellent choice for high-reliability designs, including high-speed digital, RF/microwave circuits, and aerospace electronics.
370HR is a high-performance FR-4 epoxy laminate and prepreg system known for its exceptional thermal reliability, mechanical strength, and electrical performance. With a high glass transition temperature (Tg) of 180°C, it is designed for applications requiring excellent performance under thermal and mechanical stress, making it suitable for multilayer PCBs, high-speed digital designs, and aerospace and defense electronics.
185HR is a high-performance laminate and prepreg material designed for use in high-reliability printed circuit boards (PCBs). It offers a combination of high glass transition temperature (Tg), excellent thermal stability, and low electrical loss, making it ideal for advanced applications such as high-speed digital circuits, multilayer PCBs, and aerospace electronics.
The CS-AL-88-AD2 is a high-performance metal-based laminate engineered for high-power electronics and thermal management applications. It is specifically designed to provide superior heat dissipation, electrical insulation, and mechanical durability for demanding environments. This laminate is ideal for power modules, LED lighting systems, automotive electronics, and industrial electronics.
Thermal Clad® Laminates are engineered solutions for high-performance thermal management in power electronics. They combine excellent heat dissipation with reliable electrical insulation, making them ideal for LED lighting, automotive electronics, power supplies, and industrial applications.
This guide provides an overview of Thermal Clad® materials, their properties, and how to select the most suitable material for your application.
The HT-04503 laminate is a high-performance material specifically engineered for applications requiring high thermal resistance, mechanical stability, and reliable electrical performance under extreme operating conditions. These laminates are widely used in aerospace, automotive, power electronics, and industrial electronics where high temperatures are a critical factor.
The HPL-03015(High Power Lighting)Laminate is specifically designed for high-power lighting applications, with a focus on providing excellent thermal management, high-frequency performance, and mechanical stability. These laminates are particularly suitable for advanced LED lighting systems, power electronics, and other applications requiring superior thermal conductivity and electrical performance.
The TC600™ Laminates are a high-performance class of high-frequency laminates used for microwave, RF, and high-speed digital circuit applications. These laminates are designed to provide excellent signal integrity, low loss, and high reliability, making them ideal for telecommunications, satellite communications, aerospace, defense, and other advanced electronic applications.