The DiClad® Series Laminates are high-performance materials designed for demanding applications, particularly in RF (Radio Frequency), microwave, and high-speed digital circuits. These laminates combine PTFE (Polytetrafluoroethylene) with woven fiberglass to provide excellent electrical properties and mechanical stability. T
The CLTE Series® High-Frequency Laminates are premium materials designed for superior performance in stripline and multilayer circuits. These laminates are optimized for high-frequency applications requiring precise control of electrical and mechanical properties, ensuring low loss and consistent performance.
CLTE and CLTE-XT are high-frequency laminate materials commonly used in PCB (Printed Circuit Board) designs. These materials are engineered to provide excellent electrical performance, especially at high frequencies.
AD Series™ High Frequency Laminates Stripling and Multilayer CIircuits
The AD Series™ antenna materials, including AD250C™, AD255C™, AD300D™, and AD350A™, are engineered to meet the rigorous demands of modern RF and antenna applications. With exceptional dielectric properties, low loss performance, and high thermal reliability, these laminates support next-generation communication technologies.
The AD Series™ Antenna Materials are high-performance laminate materials specifically engineered for advanced antenna and RF (Radio Frequency) applications. These materials are designed to meet the demanding requirements of modern wireless communication systems. Below is an overview of the specific laminates in the series: AD250C™, AD255C™, AD300D™, and AD350A™.
The Printed Circuit Board (PCB) is a fundamental component of all electronic devices, serving as the “command center” that ensures their functionality. However, many business owners struggle to differentiate between PCB manufacturing and PCB assembly, often leading to suboptimal decisions.