Polytetrafluoroethylene (PTFE)-based composites, such as RT-duroid laminates, are widely used due to their exceptional properties. However, working with PTFE composite materials requires awareness of safety precautions during handling, machining, and disposal.
In modern electronic devices, the performance of control boards directly impacts the reliability and accuracy of the entire system. Whether in industrial automation, medical devices, or consumer electronics, data acquisition and signal processing boards (DAQ and Signal Processing PCBs) play a crucial role. To ensure that the system can efficiently and accurately process signals from sensors and other electronic components, optimizing PCB design is essential.
We explore how to optimize data acquisition and signal processing capabilities for control boards in high-precision PCB manufacturing and provide practical tips to help you achieve high-performance electronic systems.
RT-duroid® laminates are high-performance PTFE-based composite materials manufactured by Rogers Corporation. These laminates are primarily used in RF, microwave, and high-frequency applications due to their exceptional dielectric properties, thermal stability, and chemical resistance.
RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE
composites are designed for exacting stripline and microstrip
circuit applications.
RT-duroid 5870 laminates are high-performance microwave and radio frequency (RF) circuit materials manufactured by Rogers Corporation. These laminates are widely used in high-frequency applications due to their low dielectric constant, low loss tangent, and excellent stability under various environmental conditions.
Rogers laminates, including popular materials like RT-duroid® 5870 and 5880, are well-regarded for their low outgassing properties, making them suitable for use in space, vacuum, and other environments where minimal material outgassing is critical
Line Widths for Various Characteristic Impedances of Center Stripline Devices in RT-Duroid Laminates
Stripline devices embedded in RT-duroid laminates are widely used for high-frequency circuits due to their excellent dielectric and thermal properties. Calculating the correct line width for a specific characteristic impedance (Z0Z_0Z0) is essential for optimal signal integrity and impedance matching.
Avoiding creep in board assemblies requires a combination of thoughtful design, material selection, and controlled manufacturing processes. Proactively addressing these factors ensures long-term reliability and performance of PCB assemblies, even in demanding environments.